Adhesive Bonding Compositions with Energy Augmentation for Indirect Curing
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Solution Overview
Problem
Conventional photoinitiators and thermally activated adhesives require direct line-of-sight access to a light source and suffer from poor thermal conductivity, leading to long processing times and thermal expansion mismatches during bonding, which limits their application in modern assembly methods, especially in microelectronics and dental restorations where high precision and low-temperature processing are necessary.
Innovation Solution
The use of energy augmentation structures, such as electromagnetic resonators and fractal structures, to enhance light emission and internal heating within the adhesive medium, allowing for indirect photoinitiation and localized curing without the need for direct line-of-sight access to a light source, and reducing thermal stress through controlled heating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional photoinitiators are used, then adhesive bonding can be achieved, but direct line-of-sight access to light source is required and processing time is long
Solution Approach 1:
The patent introduces an energy converter (phosphor material) as an intermediary that converts UV light to visible light, enabling indirect photoinitiation. The energy converter is embedded in the adhesive composition, allowing the photoinitiator to be activated without direct line-of-sight access to the UV light source, thus resolving the contradiction between productivity and ease of operation
Solution Approach 2:
The patent replaces the direct optical path requirement with a chemical energy conversion mechanism. Instead of relying on direct light transmission through space (optical mechanism), the system uses photon absorption and re-emission at different wavelengths (energy conversion mechanism), eliminating the line-of-sight constraint while maintaining bonding capability
2Strength
If thermally activated adhesives are used, then bonding can be achieved, but thermal conductivity is poor and thermal expansion mismatch occurs
Solution Approach 1:
The patent replaces thermal activation with photonic activation. Instead of using heat to initiate the bonding process (thermal mechanism), the system uses light energy converted to chemical energy via photoinitiators (photonic mechanism). This substitution eliminates thermal expansion issues while achieving strong bonding, resolving the contradiction between bonding strength and thermal compatibility
Solution Approach 2:
The patent changes the activation parameter from temperature to light wavelength. By using photoinitiation instead of thermal activation, the process occurs at ambient temperatures, avoiding thermal expansion mismatch between dissimilar materials while maintaining adequate bonding strength through photochemical crosslinking
3Reliability
If high temperature processing is used, then polymer curing can be achieved, but thermal stress and expansion mismatch increase
Solution Approach 1:
The patent uses photopolymerization instead of thermal curing. The phase transition from monomer to polymer is initiated by light energy rather than thermal energy, allowing complete curing to occur at ambient temperatures. This eliminates thermal stress and expansion mismatch while ensuring reliable bonding through complete polymerization
Solution Approach 2:
The patent substitutes thermal energy with photonic energy for the curing process. By using photoinitiators that absorb light and trigger polymerization, the system achieves complete curing without the harmful thermal effects, resolving the contradiction between curing completeness and thermal stress
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient polymer curing and adhesive bonding at ambient temperatures, reducing processing time and minimizing thermal stress, making it suitable for advanced processes like multilayer silicon die assembly and low-temperature applications in microelectronics and dental restorations.
Implementation Method 1
energy augmentation structures, such as electromagnetic resonators and fractal structures, to enhance light emission and internal heating within the adhesive medium
Implementation Method 2
an energy converter capable of receiving an applied electromagnetic energy, converting the applied electromagnetic energy and emitting therefrom an emitted electromagnetic energy shifted in wavelength or energy from the applied electromagnetic energy
Implementation Method 3
Conventional photoinitiators and thermally activated adhesives require direct line-of-sight access to a light source
Data Source
AI summary
An emission enhancement structure having at least one energy augmentation structure; and an energy converter capable of receiving energy from an energy source, converting the energy and emitting therefrom a light of a different energy than the received energy. The energy converter is disposed in a vicinity of the at least one energy augmentation structure such that the emitted light is emitted with an intensity larger than if the converter were remote from the at least one energy augmentation structure. Also described are various uses for the energy emitters, energy augmentation structures and energy collectors in a wide array of fields, including various adhesives applications.