Adhesive Film Drying to Prevent Fan-Out WLP Component Shift
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
During the manufacturing of electronic devices using the fan-out type WLP method, electronic components experience position shifting due to outgases from the adhesive film, which affects the sealing process.
Innovation Solution
Decreasing the water content in the adhesive film or the structure by heating and/or depressurizing before the sealing step suppresses the generation of outgases, thereby reducing position shifting of electronic components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If an adhesive film is used to temporarily fix electronic components on a support substrate, then the components can be positioned and sealed in batch, but water content in the adhesive film causes outgases during sealing that lead to position shifting of electronic components
Solution Approach 1:
The adhesive film undergoes preliminary water removal treatment (heating and/or depressurization) before the electronic components are mounted and before the sealing process. This preliminary action removes water content that would otherwise outgas during sealing and cause position shifting, thereby preventing the problem before it occurs while maintaining batch sealing capability
Solution Approach 2:
The physical state of the adhesive film is changed by controlling water content through heating and/or depressurization treatment. By changing the moisture parameter of the adhesive film before sealing, the outgassing problem is eliminated while preserving the temporary fixation function during batch sealing operations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively prevents position shifting of electronic components during the sealing process, ensuring precise placement and improved manufacturing efficiency.
Implementation Method 1
heating the adhesive film and/or depressurizing the adhesive film
Implementation Method 2
heating the adhesive film and/or depressurizing the adhesive film
Implementation Method 3
a step (4) of peeling the support substrate from the structure by decreasing an adhesive force of the adhesive resin layer (B) by applying an external stimulus
Data Source
AI summary
The method for manufacturing an electronic device includes at least: a step of preparing a structure provided with an adhesive film provided with a base material layer, an adhesive resin layer (A) provided on a first surface side of the base material layer and for temporarily fixing an electronic component, and an adhesive resin layer (B) provided on a second surface side of the base material layer and in which an adhesive force is decreased by an external stimulus, an electronic component attached to the adhesive resin layer (A) of the adhesive film, and a support substrate attached to the adhesive resin layer (B) of the adhesive film; at least one step selected from a step of decreasing water content in the adhesive film and a step of decreasing water content in the structure; and a step of sealing the electronic component with a sealing material.