Adhesive Die Catching Film for Precise Discrete Component Transfer
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Solution Overview
Problem
Existing laser-assisted transfer processes for discrete components face issues with accuracy and efficiency due to lateral movement, bouncing, and tombstoning of components on target substrates, particularly with ultra-thin and ultra-small components.
Innovation Solution
The use of adhesive die catching films, composed of viscoelastic, viscoplastic, or elastic adhesive materials, which adhere to and retain discrete components on a flexible polymer substrate, reducing post-transfer movement and enhancing precision through structural or chemical changes triggered by irradiation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional laser-assisted transfer processes are used, then transfer speed can be maintained, but component placement accuracy deteriorates due to lateral movement, bouncing, and tombstoning
Solution Approach 1:
An adhesive die catching film is introduced as an intermediary layer between the target substrate and the discrete components during laser-assisted transfer. This film temporarily captures components in their transfer path, preventing lateral movement, bouncing, and tombstoning, while allowing high-speed transfer to continue. The film acts as a mediator that resolves the conflict between transfer speed and placement accuracy.
Solution Approach 2:
The adhesive die catching film utilizes changes in adhesive parameters (tack, viscosity) to control component behavior during transfer. The adhesive material is designed to have specific rheological properties that allow it to capture components at high speed while maintaining placement precision, effectively changing the physical parameters of the transfer interface to simultaneously achieve both speed and accuracy.
2Manufacturing precision
If adhesive die catching films are used to improve placement accuracy, then component retention improves, but system complexity increases
Solution Approach 1:
The adhesive die catching film is designed as a disposable, low-cost consumable item that is easily replaced rather than maintained. This simple, single-use approach to improving placement accuracy avoids the need for complex, expensive, and difficult-to-maintain permanent fixtures or adjustment mechanisms, thereby improving precision without significantly increasing system complexity.
3Stability of the object's composition
If the adhesive die catching film uses viscoelastic or viscoplastic materials to reduce bouncing, then component stability improves, but material selection and application complexity increases
Solution Approach 1:
The adhesive die catching film utilizes changes in adhesive parameters (tack, viscosity) to control component behavior during transfer. The adhesive material is designed to have specific rheological properties that allow it to capture components at high speed while maintaining placement precision, effectively changing the physical parameters of the transfer interface to simultaneously achieve both speed and accuracy.
Solution Approach 2:
The adhesive die catching film employs composite material structures combining different adhesive formulations with specific viscoelastic or viscoplastic properties. These composite materials provide the necessary stability to reduce bouncing and tombstoning while being manufactured as integrated film structures, simplifying the overall fabrication process despite the sophisticated material properties required.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive die catching films improve component placement accuracy and process efficiency by minimizing lateral movement and bouncing, allowing for high-precision placement and reuse of the substrate in subsequent transfer processes.
Implementation Method 1
The tape is held on the vacuum chuck by suction applied to a rear surface of the flexible polymer substrate
Implementation Method 2
an adhesive die catching film disposed on the flexible polymer substrate facing a front surface of the flexible polymer substrate
Implementation Method 3
The adhesive die catching film includes a photosensitizer... configured to undergo a structural, phase, or chemical change responsive to irradiation of the material
Data Source
AI summary
A method is provided herein. The method includes (a) disposing a tape on a vacuum chuck, the tape including (i) a flexible polymer substrate; and (ii) an adhesive die catching film disposed on the flexible polymer substrate; and (b) applying suction to the tape to hold the tape on the vacuum chuck.