Adhesive Film With Dendritic And Core-Shell Conductive Particles
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Solution Overview
Problem
Adhesives used in electronic component connections require enhanced conductivity and reliability to keep pace with increasing integration density and fineness, particularly in applications like liquid crystal displays and semiconductor fields, where existing conductive films may not adequately address these needs.
Innovation Solution
An adhesive film comprising multiple layers with specific conductive particles, including dendritic conductive particles and particles with a nonconductive core and conductive layer, is developed to improve conductivity and reliability, with the first adhesive layer containing a high proportion of dendritic conductive particles and the second layer containing particles with a conductive layer on a nonconductive core, optionally including these particles in the third layer for enhanced performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional conductive films with silver powder are used, then conductivity can be achieved, but reliability is insufficient for high integration density applications
Solution Approach 1:
The invention uses composite conductive particles consisting of a non-conductive core (glass or resin) coated with a conductive layer (silver, copper, or aluminum). This composite structure provides both mechanical stability from the core and electrical conductivity from the outer layer, achieving reliable connections without requiring high volumes of conductive material. The core provides structural integrity while the conductive layer ensures electrical connection, resolving the contradiction between reliability and material quantity.
Solution Approach 2:
The invention changes the physical and chemical parameters of conductive particles by using dendritic shapes with high surface area to volume ratios and controlled particle size distributions (0.5-10 μm). These parameter changes enhance conductivity per unit volume and improve filling density in the adhesive, achieving high reliability connections with reduced overall particle content compared to conventional spherical silver powder.
2Productivity
If integration density and fineness of electronic components are increased, then device performance is improved, but adhesive conductivity and reliability requirements become more stringent
Solution Approach 1:
The invention applies local quality by creating adhesive layers with spatially varying properties - the conductive particles are distributed to provide localized conductivity paths at critical connection points while maintaining adhesive bonding properties in other regions. The dendritic particle shapes create preferential conduction paths through the adhesive layer, ensuring reliable connections in high-density applications where connection reliability becomes more stringent.
3Reliability
If oxide film formation occurs on electrodes, then connection stability deteriorates, but the adhesive must maintain connection integrity
Solution Approach 1:
The invention converts the harmful effect of oxide film formation into a beneficial outcome by designing conductive particles with specific properties that can penetrate or bond through oxide layers. The dendritic particle shapes with high aspect ratios can physically pierce through oxide barriers, while the conductive metal layers (particularly copper and aluminum) form strong metallurgical bonds with electrode surfaces even in the presence of oxides, maintaining connection integrity despite oxide formation.
Data Source
AI summary
One aspect of the present invention is an adhesive film comprising a first adhesive layer comprising a first conductive particle that is a dendritic conductive particle; and a second adhesive layer containing a second conductive particle that is a conductive particle other than the first conductive particle, the second conductive particle comprising a nonconductive core body and a conductive layer provided on the core body.