Adhesive Film Vacuum Suction for Accurate Probe Testing
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Solution Overview
Problem
The evaluation of electronic components is hindered by wrinkles in adhesive films that come into contact with probe terminals during heating or cooling, leading to inaccurate property assessments.
Innovation Solution
A method involving the use of vacuum suction to suppress contact between the adhesive film and probe terminals by sucking the adhesive film in regions not affixed with electronic components, ensuring stable and accurate property evaluation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the adhesive film is used to fix the electronic component during property evaluation, then the component can be securely held and positioned, but wrinkles are generated in the adhesive film during heating or cooling which interfere with the probe terminal contact
Solution Approach 1:
The adhesive film is divided into two functional regions: a first region that contacts the probe terminal for electrical connection and a second region that is vacuum-sucked to suppress wrinkles. This segmentation allows the film to simultaneously provide secure holding and maintain measurement precision by isolating the wrinkle-prone area from the probe contact area.
Solution Approach 2:
Different regions of the adhesive film are given different properties: the first region is designed to be smooth and probe-friendly for accurate electrical contact, while the second region is designed to be vacuum-suckable for wrinkle suppression. This local differentiation resolves the contradiction by optimizing each region for its specific function.
2Reliability
If the adhesive film is heated or cooled for property evaluation, then the electronic component's reliability can be assessed under extreme conditions, but wrinkles are generated in the adhesive film which come into contact with the probe terminal
Solution Approach 1:
The adhesive film is segmented into a first region for probe contact and a second region for vacuum suction. During heating or cooling for reliability assessment, the vacuum suction applied to the second region suppresses wrinkle generation, allowing the thermal stress test to proceed without interfering with probe terminal contact.
Solution Approach 2:
The vacuum suction mechanism acts as an intermediary force that counteracts the wrinkle-forming tendency of the adhesive film during thermal cycling. By applying vacuum to the second region, the film is kept taut and wrinkle-free in the probe contact area, enabling stable property evaluation under extreme temperatures.
3Measurement precision
If the probe terminal contacts the adhesive film during property evaluation, then electrical connection can be established, but wrinkles in the adhesive film interfere with the probe terminal contact and prevent accurate evaluation
Solution Approach 1:
The adhesive film is divided into a first region that is kept wrinkle-free for probe terminal contact and a second region that is vacuum-sucked to suppress wrinkles. This ensures that the probe terminal contacts only the smooth first region, eliminating wrinkle interference and enabling accurate electrical connection and property evaluation.
Solution Approach 2:
Vacuum suction is applied to the second region of the adhesive film to suppress wrinkle formation. This pneumatic action keeps the film taut and smooth in the probe contact area, allowing the probe terminal to make reliable electrical contact without interference from wrinkles.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for precise and reliable evaluation of electronic components by minimizing interference from wrinkles, enabling effective property assessment at various temperatures.
Implementation Method 1
a first vacuum suction unit provided in a region on an outer peripheral side different from the electronic component installation region, and sucking the adhesive film
Data Source
AI summary
A method for manufacturing electronic apparatus includes: a step (A) of preparing a structure provided with an adhesive film and one or two or more electronic components affixed to an adhesive surface of the adhesive film; a step (B) of disposing the structure in the electronic component testing apparatus such that the electronic component is positioned over an electronic component installation region of a sample stand of the electronic component testing apparatus in a defined manner; a step (C) of evaluating the properties of the electronic component in a state of being affixed to the adhesive film with the probe terminal being in contact with a terminal of the electronic component; and a step (D) of picking up the electronic component from the adhesive film after the step (C). A defined sample stand is also provided.