Adhesive Frame Encapsulation for Hermetic Singulated Components

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Solution Overview

Problem

Conventional encapsulation methods in the semiconductor industry often result in non-hermetic or only almost hermetic seals, leading to reduced long-term reliability and shortened useful life of encapsulated components.

Innovation Solution

A method for producing singulated encapsulated components using a frame structure formed from an adhesive, which is bonded to a cover substrate and hardened, allowing for post-treatment to achieve hermetic encapsulation through surface conversion of the frame structure.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional encapsulation methods are used, then the encapsulation process can be completed, but the hermeticity and long-term reliability are reduced

Engineering Contradiction:

Improvehermeticity and long-term reliabilityVSAvoidencapsulation process complexity

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The encapsulation process is segmented into distinct stages: frame structure formation, bonding, hardening, and post-treatment. This allows each stage to be optimized independently, with the post-treatment stage specifically addressing hermeticity requirements through surface conversion of the frame structure.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The frame structure is formed and bonded in advance before the final hermetic sealing is achieved through post-treatment. This preliminary action allows the structural framework to be established early, while the critical hermeticity requirement is satisfied in a dedicated subsequent stage.

Inventive Principle:

Principle #10Preliminary action

2Reliability

If multiple separate steps are used for frame structure formation and bonding, then the encapsulation can be achieved, but the number of work steps increases

Engineering Contradiction:

Improveencapsulation qualityVSAvoidnumber of work steps

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

The frame structure formation and bonding operations are merged into a single adhesive application step. The adhesive serves dual functions: forming the frame structure that defines the encapsulation geometry and providing the bonding material that attaches the cover substrate. This eliminates separate work steps while maintaining encapsulation quality.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The adhesive material performs multiple functions simultaneously: it forms the frame structure, provides bonding between substrates, and after hardening and post-treatment, contributes to the hermetic seal. This multi-functionality reduces the number of different materials and processes required.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Reliability

If conventional adhesives are used without post-treatment, then the process is simple, but the hermeticity is insufficient

Engineering Contradiction:

ImprovehermeticityVSAvoidprocess complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The physical and chemical parameters of the adhesive are changed through post-treatment processes such as heat treatment, UV irradiation, or plasma treatment. These parameter changes induce surface conversion that transforms the adhesive surface into a hermetic barrier, transitioning the material properties to achieve the required sealing performance.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The encapsulation structure becomes a composite system combining the base adhesive material with a surface-converted hermetic layer. The bulk adhesive provides structural and bonding functions, while the surface layer provides hermetic sealing, creating a multi-functional composite material system.

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method simplifies the encapsulation process, reduces the number of work steps, and achieves improved hermeticity and long-term reliability of the encapsulated components.

Implementation Method 1

achieves hermetic encapsulation by subsequent chemical and/or physical treatment of the frame structure

Methodology Applied

Scientific EffectSurface conversion:

Implementation Method 2

achieves hermetic encapsulation by subsequent chemical and/or physical treatment of the frame structure

Methodology Applied

Scientific EffectChemical treatment:

Implementation Method 3

achieves hermetic encapsulation by subsequent chemical and/or physical treatment of the frame structure

Methodology Applied

Scientific EffectPhysical treatment:

Implementation Method 4

The frame structure is hardened

Methodology Applied

Scientific EffectHardening:

Data Source

PatentUS12283491B2Method for producing singulated encapsulated components

Publication Date: 2025.04.22 EV GRP E THALLNER GMBH

AI summary

A method for producing singulated encapsulated components. The method includes the steps of application of a frame structure on a substrate surface of a substrate, wherein the frame structure surrounds components arranged on the substrate surface; bonding of a cover substrate on the frame structure; hardening of the frame structure; and singulation of the encapsulated components, wherein the frame structure is formed from an adhesive.