Adhesive-Free Cushioning for Substrate Containers
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Solution Overview
Problem
The use of cushioning materials composed of two different materials in substrate storing containers for semiconductor wafers poses a risk of outgas generation due to adhesives, which can contaminate clean rooms when transporting the containers.
Innovation Solution
A packing structure that integrates a first cushioning portion with a cushioning support and connecting portion made from the same material, and a second cushioning portion with a cushioning plate-like structure and softer leg portions, allowing for secure fixation without adhesives, thereby preventing outgas contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If cushioning materials composed of two different materials are used and fixed with adhesive, then the cushioning materials are securely fixed, but outgas is generated which can contaminate clean rooms
Solution Approach 1:
The invention extracts and eliminates the adhesive component from the cushioning material assembly. By using a through-hole structure where the first cushioning material passes through the second cushioning material, the harmful adhesive is completely removed while maintaining secure fixation through mechanical interlocking
Solution Approach 2:
The first cushioning material is nested through the through-hole of the second cushioning material, creating a layered structure where one material passes through another. This nesting approach provides secure fixation without requiring adhesive bonding between the two different materials
2Strength
If adhesive is used to fix cushioning materials, then the fixation is strong, but the adhesive outgas can cling to packing bags and be carried into clean rooms
Solution Approach 1:
The adhesive is completely extracted from the system. The fixation strength is achieved through the mechanical structure where the first cushioning material passes through the through-hole of the second cushioning material, eliminating the source of outgas contamination while maintaining adequate fixation strength
Solution Approach 2:
The through-hole structure acts as an intermediary mechanism that enables fixation between two different cushioning materials without direct contact or adhesive bonding. The structural arrangement provides the necessary fixation strength through geometric interlocking rather than chemical bonding
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively fixes the cushioning materials without using adhesives, reducing the risk of outgas contamination in clean rooms and providing effective vibration absorption and impact protection for the semiconductor wafers during transportation.
Implementation Method 1
cushioning leg portions which are configured by a cushioning material which is softer than the cushioning-portion connecting portion of the first cushioning portion, and extend downwards from the cushioning plate-like portion
Data Source
AI summary
The first cushioning portion includes: a cushioning support portion that directly abuts the substrate storing container to support the substrate storing container; and a cushioning-portion connecting portion that is connected to the cushioning support portion, and extends downwards from the cushioning support portion. The second cushioning portion includes: a cushioning plate-like portion in which a through-hole is formed; and cushioning leg portions which are configured by a cushioning material which is softer than the cushioning-portion connecting portion of the first cushioning portion, and extend downwards from the cushioning plate-like portion. The cushioning plate-like portion supports the first cushioning portion in a state in which the cushioning-portion connecting portion penetrates through the through-hole of the cushioning plate-like portion.