Optical Module Layout Without Adhesive for Thinner Fingerprint Sensing
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Solution Overview
Problem
The existing optical modules in mobile terminals, such as fingerprint modules, have a large thickness due to the adhesive layers used to bond components, resulting in increased space occupation and reduced signal strength.
Innovation Solution
The optical module design places the photosensitive unit and wiring structure directly on the collimator, eliminating the need for a bearer substrate and adhesive, with optional features like a wiring protection layer and filtering layer to enhance protection and accuracy, and using a plating structure for precise molding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If adhesive layers are used to bond the collimator to the display screen and photosensitive unit, then bonding strength is improved, but the thickness of the optical module increases
Solution Approach 1:
The patent removes the adhesive layers from the optical module structure. The collimator is directly bonded to the photosensitive unit without adhesive, eliminating the thickness contribution of adhesive layers while maintaining bonding through direct contact and structural integration.
Solution Approach 2:
The collimator and photosensitive unit are merged into a closely integrated structure where the collimator is directly bonded to the photosensitive unit. This merging eliminates the need for separate adhesive layers and reduces the overall thickness of the optical module.
2Reliability
If adhesive layers are used to bond components, then bonding reliability is improved, but the space occupation of the optical module increases
Solution Approach 1:
The adhesive layers are extracted from the bonding process. The collimator is directly bonded to the photosensitive unit without adhesive, eliminating the volume occupied by adhesive while maintaining bonding reliability through direct structural contact and integration.
Solution Approach 2:
The bonding interface is merged by eliminating the adhesive layer and creating a direct bond between the collimator and photosensitive unit. This reduces the volume of the optical module while maintaining bonding reliability through direct contact and structural integration.
3Stability of the object's composition
If a bearer substrate is used to support the photosensitive unit and wiring structure, then structural stability is improved, but the thickness of the optical module increases
Solution Approach 1:
The bearer substrate is removed from the optical module structure. The photosensitive unit and wiring structure are directly integrated with the collimator, eliminating the thickness contribution of the bearer substrate while maintaining structural stability through direct bonding and structural integration.
Solution Approach 2:
The collimator, photosensitive unit, and wiring structure are merged into an integrated structure where the collimator serves as the supporting element. This eliminates the need for a separate bearer substrate and reduces the overall thickness of the optical module.
4Strength
If adhesive layers with large thickness are used, then bonding strength is improved, but the photosensitivity efficiency decreases
Solution Approach 1:
The adhesive layers are extracted from the optical path between the collimator and photosensitive unit. By eliminating the adhesive, the light path is cleared of obstructions that would reduce photosensitivity efficiency, while bonding strength is maintained through direct structural contact.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces the optical module's thickness, enhances signal strength, and improves user experience by minimizing space occupation and increasing photosensitivity efficiency.
Implementation Method 1
light is reflected by the user's fingerprint, and enters the photosensitive unit through the light passing hole opened in the collimator
Implementation Method 2
light is reflected by the user's fingerprint, and enters the photosensitive unit through the light passing hole opened in the collimator to obtain fingerprint information
Data Source
AI summary
An optical module and a mobile terminal are provided. The optical module includes a collimator, a photosensitive unit, and a wiring structure, wherein the photosensitive unit is arranged on a surface of one side of the collimator, and the wiring structure is arranged on a surface of one side, away from the collimator, of the photosensitive unit.