Conductive Adhesive Gradient for Elastic Wiring Connections

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Solution Overview

Problem

Wiring lines on elastic bases are prone to breaking during pressure bonding processing in electronic devices, leading to connectivity issues.

Innovation Solution

A device with an elastic base, wiring lines, a coupling member, and an electrically conductive adhesive layer where the wiring lines overlap with the adhesive layer, and the adhesive's degree of polymerization decreases in the extending direction, reducing the likelihood of wire breakage during coupling and subsequent shocks.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If pressure bonding processing is applied to couple wiring lines to the coupling member, then electrical connectivity is achieved, but wiring lines on elastic bases are prone to breaking

Engineering Contradiction:

Improveelectrical connectivityVSAvoidwiring line integrity

Core Design Contradiction:

ReliabilityVSStrength

Solution Approach 1:

The patent applies parameter changes by controlling the degree of polymerization of the adhesive layer to decrease in the extending direction of the wiring line. This gradient in polymerization degree creates a gradient in adhesive strength, with the peripheral portions having lower strength to reduce stress concentration on the wiring line during pressure bonding, while the central portion maintains higher strength for reliable electrical connectivity.

Inventive Principle:

Principle #35Parameter changes

2Strength

If uniform adhesive strength is provided across the adhesive layer, then strong bonding is achieved, but stress concentration occurs at peripheral portions causing wire breakage

Engineering Contradiction:

Improvebonding strengthVSAvoidstress concentration

Core Design Contradiction:

StrengthVSObject-affected harmful factors

Solution Approach 1:

The patent applies local quality by creating a non-uniform adhesive layer with spatially varying degree of polymerization. The peripheral portions have a lower degree of polymerization and thus lower adhesive strength to reduce stress concentration, while the central portion has a higher degree of polymerization for strong bonding. This local differentiation of adhesive properties resolves the contradiction between strong bonding and stress reduction.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively suppresses wire breakage at the adhesive layer's peripheral portions during coupling and post-coupling shocks, ensuring reliable connectivity and durability.

Implementation Method 1

an electrically conductive adhesive layer provided between the wiring line and the coupling member

Methodology Applied

Scientific EffectAdhesion: Adhesive

Data Source

PatentUS12010791B2Device, electronic apparatus, and wiring connection method

Publication Date: 2024.06.11 SONY GROUP CORP

AI summary

A device includes an elastic base, a device body provided on the base, a wiring line provided on the base, a coupling member coupled to the wiring line, and an electrically conductive adhesive layer provided between the wiring line and the coupling member. The wiring line extends from the electrically conductive adhesive layer to the device body. The wiring line has a wiring portion overlapping with the electrically conductive adhesive layer. The degree of polymerization of the electrically conductive adhesive layer decreases in the extending direction of the wiring portion.