Substrate Adhesive Groove Layout for Air Bubble Release

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Solution Overview

Problem

Air bubbles between adhesive layers and other stacked layers in electronic devices cause appearance flatness issues, affecting reliability and quality.

Innovation Solution

Incorporating grooves in the adhesive layers as exhaust channels to discharge air bubbles towards the edges, ensuring stable structural integrity and preventing poor electrical connections.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If adhesive layers are used to bond substrates, then structural integrity is improved, but air bubbles are trapped causing appearance flatness degradation

Engineering Contradiction:

Improvestructural integrityVSAvoidappearance flatness

Core Design Contradiction:

StrengthVSShape

Solution Approach 1:

The adhesive layer incorporates grooves that create a porous structure, allowing air bubbles to escape during the bonding process while maintaining the adhesive's structural integrity and bonding strength

Inventive Principle:

Principle #31Porous materials

Solution Approach 2:

The grooves in the adhesive layer convert the harmful effect of trapped air bubbles into a beneficial escape path, allowing air to be discharged during bonding while maintaining strong adhesion between substrates

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

2Shape

If grooves are added to adhesive layers to discharge air bubbles, then appearance flatness is improved, but device complexity increases

Engineering Contradiction:

Improveappearance flatnessVSAvoidadhesive layer structure

Core Design Contradiction:

ShapeVSDevice complexity

Solution Approach 1:

The adhesive layer is segmented into multiple regions by the grooves, creating a structured pattern that facilitates air bubble discharge while maintaining overall structural integrity and simplifying the bonding process

Inventive Principle:

Principle #1Segmentation

Data Source

PatentUS20260068363A1Electronic device

Publication Date: 2026.03.05 INNOLUX CORP

AI summary

An electronic device includes a support substrate, a plurality of first substrates, a plurality of semiconductor elements and a plurality of adhesive layers. The first substrates are disposed on the support substrate. The semiconductor elements are disposed on at least one of the first substrates. The adhesive layers are disposed between the support substrate and the first substrates. Two adjacent ones of the first substrates are separated from each other by a first gap defining a first distance, and two adjacent ones of the adhesive layers are separated from each other by a second gap defining a second distance. The first distance is different from the second distance.