Adhesive Attachment With Conductive Ground Pin
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Solution Overview
Problem
Existing adhesive attachment assemblies fail to provide a reliable electrically conductive ground path for attachment components mounted on substrates, as conventional adhesive bonding agents insulate components from the substrate, and conductive particle inclusions weaken the bond and have limited current-carrying capacity.
Innovation Solution
An adhesive attachment assembly with a conductive ground pin that is pressed into contact with the substrate, either directly or through a collar, to establish an electrically conductive ground path, allowing for secure grounding of attachment components and structures without requiring welding or specialized equipment, even on non-conductive substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If adhesive bonding agent is used to mount attachment component, then bonding strength is achieved, but electrical conductive contact with substrate is lost
Solution Approach 1:
The system is divided into separate functional components: the adhesive bonding agent provides mechanical bonding strength, while a dedicated conductive ground pin provides electrical conductive contact. This segmentation allows each component to optimize its specific function without compromising the other.
Solution Approach 2:
The conductive ground pin acts as an intermediary element that bridges the electrical connection between the attachment component and the substrate. It penetrates through the adhesive layer to establish direct electrical contact with the substrate, mediating the electrical connection that would otherwise be blocked by the insulating adhesive.
2Reliability
If conductive particle inclusions are added to adhesive, then electrical conductive contact is improved, but bond strength is weakened
Solution Approach 1:
The system separates the bonding function and electrical conduction function into different components. The adhesive bonding agent maintains pure bonding strength without conductive particles, while the conductive ground pin provides the necessary electrical conductive contact path.
Solution Approach 2:
Instead of trying to make the adhesive itself conductive through particle inclusions, the system creates a separate copying path for electrical conduction using the ground pin, which replicates the electrical connection function independently from the bonding function.
3Reliability
If welding is used to achieve electrical ground, then reliable grounding is achieved, but equipment complexity and material constraints increase
Solution Approach 1:
The system replaces the complex welding process (thermal/mechanical system) with a simpler mechanical insertion process. The conductive ground pin is simply pressed or inserted through the adhesive layer to establish electrical contact, eliminating the need for welding equipment, specialized training, and material compatibility constraints.
Solution Approach 2:
The conductive ground pin serves as a simple, inexpensive component that can be easily replaced if needed. It eliminates the need for expensive welding equipment and specialized personnel, providing a cost-effective solution for achieving reliable electrical grounding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables secure, electrically conductive bonding of attachment components to substrates, ensuring effective grounding and high current-carrying capacity, suitable for various materials including aluminum and carbon fiber composites, without compromising bond strength.
Implementation Method 1
A conductive ground pin is pressed into conductive contact with the substrate when a selected structure is mounted onto the attachment component
Data Source
AI summary
An adhesive attachment is provided for securely mounting an attachment component such as a threaded stud or the like on the surface of a selected substrate, wherein the adhesive attachment provides an electrically conductive ground path for grounding the attachment component and/or a selected structure mounted thereto to the substrate. In one preferred form, the attachment component is a threaded element such as a stud or nut. Upon mounting of the attachment component on the substrate and subsequent connection of the threaded element to a mating threaded member, e.g., of the selected structure to be mounted onto the attachment component, a conductive ground pin is pressed into electrical contact with the substrate for grounding the attachment component and/or the selected structure mounted thereto.