Adhesive Formulation for Inert Materials Bonding
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Solution Overview
Problem
The inertness of impregnated or impermeabilized materials, particularly porous materials, poses a challenge for bonding due to the absence of reactive groups, which hinders effective chemical interactions with adhesives, especially in environments exposed to water and solvents.
Innovation Solution
A photo-thermally curable adhesive formulation comprising 40-80 wt.% epoxy monomer, 15-30 wt.% oxetane monomer, 0.1-10 wt.% adhesion promoter, 0.1-5 wt.% sensitizer, and 1-10 wt.% radiation and temperature activable photoinitiator or a mixture of photoinitiator and thermal initiator, which ensures strong bonding between inert materials and resistance to water and solvents.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If impregnated or impermeabilized inert materials are used, then water and solvent resistance is improved, but bonding strength deteriorates due to absence of reactive groups
Solution Approach 1:
The patent introduces a silane coupling agent as an intermediary substance that chemically bonds to both the inert impregnated material surface and the polymer matrix. This mediator creates chemical bridges across the interface, enabling effective stress transfer and achieving strong bonding despite the inertness of the impregnated material. The silane coupling agent contains reactive groups that interact with both the substrate and the adhesive matrix, resolving the contradiction between water resistance and bonding strength.
Solution Approach 2:
The patent modifies the chemical composition parameters of the adhesive system by incorporating specific ratios of silane coupling agents, epoxy resins, and crosslinking agents. By changing the chemical parameters of the adhesive formulation, the system achieves compatibility with inert impregnated surfaces while maintaining strong bonding and water resistance simultaneously.
2Ease of operation
If conventional adhesives are used on inert materials, then ease of application is improved, but bonding durability deteriorates in solvent environments
Solution Approach 1:
The patent creates a composite adhesive system combining epoxy resins, silane coupling agents, and crosslinking agents in specific proportions. This composite formulation provides both ease of application (like conventional adhesives) and enhanced bonding durability in solvent environments through the synergistic effects of its components, particularly the silane coupling agent that ensures stable chemical bonding to inert surfaces.
3Reliability
If high crosslinking density is achieved for solvent resistance, then chemical stability is improved, but brittleness increases reducing bonding flexibility
Solution Approach 1:
The patent introduces localized flexibility through plasticizers and flexible chain segments at specific locations within the polymer matrix. This creates local quality variations where crosslinked regions provide chemical stability while plasticized regions maintain flexibility and toughness, preventing the entire bonding interface from becoming brittle despite high crosslinking density.
Solution Approach 2:
The adhesive system combines rigid crosslinked networks with flexible plasticizer molecules and flexible chain segments, creating a composite material structure that simultaneously achieves chemical stability through crosslinking and bonding flexibility through the plasticizing and flexible chain components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive formulation achieves high strength and chemical resistance after curing, enabling effective bonding of inert materials, including microelectronic components and silicon chips, even when impregnated, and maintains stability in solvent environments.
Implementation Method 1
1-10 wt.-% radiation and temperature activable photoinitiator or a mixture of a photoinitiator and a thermal initiator
Implementation Method 2
0.1 to 10 wt.-% adhesion promotor
Data Source
AI summary
The present invention relates to adhesive formulations for bonding materials, comprising 40 to 80 wt.-% of an epoxy monomer, and 15 to 30 wt.-% of an oxetane monomer, and 0.1 to 10 wt.-% of an adhesion promotor, and 0.1 to 5 wt.-% of a sensitizer, and 1 to 10 wt.-% of a radiation and temperature activable photoinitiator or a mixture of a photoinitiator and a thermal initiator. Further, the present invention relates to a method for bonding at least two parts of which one is at least an inert material, comprising the steps applying to one part an adhesive formulation as described, placing another part to be bond on the one part, exposing the parts to UV light radiation and heat treating of the part.