Temporary Adhesive Laminate Bonding for Void-Free Thin Substrates
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Solution Overview
Problem
Conventional methods for bonding semiconductor substrates to supports using temporary adhesive layers face challenges with materials of different melt viscosities, leading to defects like voids and inadequate thermal resistance during processes such as CVD, which hampers the productivity of thin substrates.
Innovation Solution
A method involving preheating the substrate and support to different temperatures between 50°C and 250°C, followed by bonding with a temporary adhesive material comprising multiple layers with specific melt viscosity ratios, allowing for efficient bonding and separation while enhancing thermal resistance and filling characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional bonding methods are used with materials of different melt viscosities, then bonding can be achieved, but voids and defects occur in the adhesive layer
Solution Approach 1:
The patent applies parameter changes by independently controlling the temperatures of the substrate and support before bonding. Specifically, the substrate is heated to 50-250°C and the support is heated to 50-250°C at a temperature different from the substrate, creating optimal conditions for the temporary adhesive material to flow and fill gaps without forming voids, thereby resolving the contradiction between achieving reliable bonding and preventing manufacturing defects
Solution Approach 2:
The patent employs preliminary action by preheating both the substrate and support to predetermined temperatures before the actual bonding process. This preliminary heating ensures that the temporary adhesive material reaches the appropriate viscosity state for optimal bonding, preventing void formation while ensuring reliable adhesion between the substrate and support
2Ease of manufacture
If a single-layer temporary adhesive material is used, then the bonding process is simple, but thermal resistance during CVD processes is inadequate
Solution Approach 1:
The patent applies segmentation by dividing the temporary adhesive material into multiple layers with different material properties. The first layer (contacting substrate) has melt viscosity of 10-1000 Pa·s at bonding temperature for good substrate adhesion, while the second layer (contacting support) has melt viscosity of 0.1-100 Pa·s for smooth bonding. This multi-layer structure provides adequate thermal resistance during CVD processes while maintaining ease of manufacture through systematic material selection
Solution Approach 2:
The patent employs composite materials by combining multiple adhesive layers with different viscosity characteristics. The temporary adhesive material comprises a first layer and a second layer with specifically controlled melt viscosities, creating a composite structure that provides both the thermal resistance needed for CVD processes and the bonding performance required for reliable substrate-support adhesion
3Productivity
If the substrate is thinned for three-dimensional mounting, then higher density and larger capacity are achieved, but the substrate becomes more fragile and prone to breaking
Solution Approach 1:
The patent applies beforehand cushioning by introducing a temporary adhesive material system that provides mechanical support and protection to the thinned substrate during fragile processing steps. The multi-layer adhesive structure with controlled viscosities ensures uniform stress distribution and prevents substrate breaking during grinding, TSV formation, and wiring layer deposition, enabling three-dimensional mounting of fragile thinned substrates
4Reliability
If the temporary adhesive layer is required to withstand grinding and TSV formation, then sufficient durability is needed, but this makes final separation difficult
Solution Approach 1:
The patent applies local quality by designing the temporary adhesive material with different properties in different layers. The first layer provides high durability and strong adhesion to withstand grinding and TSV formation, while the second layer is formulated for easy separation from the support. This spatial differentiation of adhesive properties within the multi-layer structure resolves the contradiction between requiring sufficient durability during processing and enabling easy final separation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables defect-free bonding of substrates with different materials, improves thermal resistance, and increases the productivity of thin substrates by preventing voids and ensuring effective separation and cleaning.
Implementation Method 1
bonding the support and the substrate via the temporary adhesive material
Implementation Method 2
preheating the support and the substrate before the bonding is started; the substrate is heated to a temperature of 50°C or more and 250°C or less, while the support is heated to a temperature of 50°C or more and 250°C or less
Data Source
Figure 1~3
AI summary
The present invention is a method for manufacturing a laminate including a support and a substrate having a back surface to be processed and a non-processed surface, the support and the non-processed surface being bonded via a temporary adhesive material. The method includes the steps of: (a) laminating the temporary adhesive material on either or both of the support and the non-processed surface of the substrate; (b) preheating the support and the substrate before the bonding is started; and (c) bonding the support and the substrate via the temporary adhesive material. In the step (b), the substrate is heated to a temperature of 50°C or more and 250°C or less, while the support is heated to a temperature of 50°C or more and 250°C or less but different from that of the substrate. In the step (c), the bonding is started with the temperatures of the support and the substrate after the preheating being different. This provides a method for manufacturing a laminate where a support and a substrate can be easily bonded via a temporary adhesive material and also easily separated from each other, the laminate has excellent resistance to thermal process, and it is possible to increase the productivity of thin substrates.