Thermally Conductive Adhesive Layer for Circuit Boards

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Solution Overview

Problem

Adhesive layers in electronic devices often have poor thermal conductivity, which hinders effective heat dissipation from heat sources like CPUs, leading to potential overheating issues.

Innovation Solution

A resin composition comprising a styrene-butadiene-styrene block copolymer, styrene-ethylene-butene-styrene block copolymer, polyphenylene ether, dendritic acrylate oligomer, heat-conducting powders, and flame retardants is used to form a heat-resistant adhesive layer with improved thermal conductivity, enhancing heat diffusion and distribution.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If conventional adhesive materials are used, then the adhesive layer can be easily manufactured and applied, but the thermal conductivity remains poor

Engineering Contradiction:

Improvethermal conductivityVSAvoidmanufacturing complexity

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

The patent uses a composite material system consisting of thermoplastic resin (polybutadiene-styrene block copolymer) combined with heat-conducting powders (alumina, aluminum nitride, boron nitride) to create an adhesive layer that achieves high thermal conductivity (1.9-2.8 W/m·k) while maintaining ease of manufacture through conventional lamination processes

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The patent optimizes the weight ratio of heat-conducting powder to thermoplastic resin (95:5 to 50:50) and controls the particle size distribution of the heat-conducting powders to maximize thermal conductivity while maintaining processability and manufacturing ease

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The adhesive layer achieves thermal conductivity values ranging from 1.9 to 2.8 W/m·k, effectively managing heat dissipation and ensuring even heat distribution across electronic components.

Implementation Method 1

heat-conducting powders... enhancing heat diffusion and distribution

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS10745595B2Resin composition, adhesive layer, and circuit board utilizing same

Publication Date: 2020.08.18 QING DING PRECISION ELECTRONICS HUAIAN CO LTD

AI summary

A resin having thermal conductivity comprises a styrene-butadiene-styrene block copolymer in 35 to 85 parts by weight, a styrene-ethylene-butene-styrene block copolymer in 5 to 65 parts by weight, a polyphenylene ether in 3 to 35 parts by weight; and a dendritic acrylate oligomer in 3 to 45 parts by weight. An adhesive layer and a circuit board using the resin composition are also described.