Adhesive Layer Surface Layout for Easier Semiconductor Die Removal
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Solution Overview
Problem
The challenge in manufacturing electronic components and semiconductor devices is the difficulty in removing processed products from pressure sensitive adhesive sheets, which hinders productivity.
Innovation Solution
Attaching the object to be processed to an uneven surface of a pressure sensitive adhesive layer and performing processing on it, followed by easy removal from the layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the object to be processed is attached to a flat pressure sensitive adhesive sheet, then the processing can be performed stably, but the processed product is difficult to remove from the sheet
Solution Approach 1:
The pressure sensitive adhesive sheet is designed with locally different surface properties: a flat region for stable processing and an uneven region for easy removal. This local differentiation allows the sheet to provide both stable processing conditions and easy removal of processed products without compromising either function.
Solution Approach 2:
The pressure sensitive adhesive sheet is divided into functionally distinct regions: a first region with a flat surface for processing and a second region with an uneven surface for removal. This segmentation allows each region to optimize its specific function, resolving the contradiction between processing stability and removal ease.
2Productivity
If the processed product is removed from the pressure sensitive adhesive sheet, then productivity is improved, but the removal process becomes difficult and time-consuming
Solution Approach 1:
The pressure sensitive adhesive sheet incorporates an uneven surface region specifically designed to reduce adhesion strength. When the processed product is placed on this uneven region, the reduced contact area significantly decreases adhesion, enabling rapid and easy removal that improves productivity without time loss.
3Strength
If the pressure sensitive adhesive sheet has a flat surface, then the adhesion strength is high for stable processing, but the processed product cannot be easily removed
Solution Approach 1:
The pressure sensitive adhesive sheet is segmented into a first region with high adhesion strength for stable processing and a second region with reduced adhesion strength for easy removal. This segmentation resolves the contradiction by providing both strong adhesion where needed and weak adhesion where removal is required.
Solution Approach 2:
Different regions of the pressure sensitive adhesive sheet are given different surface qualities: the flat first region provides strong adhesion for stable processing, while the uneven second region provides weak adhesion for easy removal. This local quality differentiation simultaneously satisfies both requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances productivity by facilitating the removal of processed products, improving handling and efficiency in manufacturing processes.
Implementation Method 1
attaching an object to be processed used for manufacturing an electronic component or a semiconductor device to an uneven surface included in a pressure sensitive adhesive layer
Data Source
AI summary
Provided is a new method by which it is easier to remove an element after processing, so as to improve productivity in manufacturing an electronic component or a semiconductor device. An object to be processed used in manufacturing an electronic component or a semiconductor device is attached to an uneven surface of a pressure sensitive adhesive layer. The object to be processed on the pressure sensitive adhesive layer is processed to obtain a processed product. The processed product is removed from the pressure sensitive adhesive layer.