Adhesive Layer 3D Network for Metal-Resin Bonding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In advanced semiconductor packaging, particularly in Cu RDL structures, there is a challenge in maintaining adhesion and mechanical reliability between heterogeneous interfaces like Cu/polyimide or Cu/epoxy due to copper oxide growth caused by moisture and oxygen diffusion during high-temperature processes, compromising the reliability of the redistribution layer.
Innovation Solution
An adhesive comprising 0.0001-3 weight percent of amino silane, 0.0001-1 weight percent of a crosslinker, and 0.0001-1 weight percent of an organometallic compound forms a 3-dimensional network structure with a metal atomic ratio less than 50%, enhancing peel strength and preventing damage from moisture, oxygen, and high temperatures, suitable for electronic packaging.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If passivation layers (polyimide, epoxy, etc.) are used to withstand high temperature processes, then thermal resistance is improved, but susceptibility to moisture and oxygen diffusion causes copper oxide growth
Solution Approach 1:
The patent applies composite materials by formulating an adhesive composition containing multiple components: amino silane (0.0001-3 wt%), crosslinker (0.0001-1 wt%), organometallic compound (0.0001-1 wt%), and solvent (0.0005-95 wt%). This multi-component composite system provides both thermal resistance and barrier properties against moisture and oxygen, resolving the contradiction between thermal withstand capability and protection against harmful diffusion.
Solution Approach 2:
The patent employs parameter changes by carefully controlling the concentrations of each component in the adhesive composition. The specific weight percent ranges of amino silane, crosslinker, and organometallic compound are optimized to achieve the desired balance of thermal stability and barrier performance, transforming the material properties to simultaneously address both requirements.
2Stability of the object's composition
If copper redistribution layer is manufactured with passivation layers, then thermal stability is improved, but adhesion and mechanical reliability deteriorate due to copper oxide growth
Solution Approach 1:
The adhesive composition acts as an intermediary layer between the copper redistribution layer and the passivation layer. The amino silane and crosslinker components form strong chemical bonds with copper, while the organometallic compound provides barrier functionality. This intermediary adhesive layer prevents direct contact between copper and harmful environmental factors, maintaining both thermal stability and adhesion reliability.
Solution Approach 2:
The patent applies local quality by designing the adhesive layer with specific functional zones: the amino silane component provides copper chelation and bonding at the metal interface, the crosslinker creates a dense network structure for mechanical strength, and the organometallic compound forms the barrier function. Each component is localized to perform its specific function, ensuring both thermal stability and adhesion reliability at different interfaces.
3Reliability
If adhesive layer is formed to protect from moisture and oxygen, then reliability is improved, but metal atomic ratio increases which may affect electronic properties
Solution Approach 1:
The patent applies partial action by using small but optimized amounts of organometallic compound (0.0001-1 wt%) in the adhesive formulation. This partial incorporation provides sufficient barrier functionality against moisture and oxygen while keeping the overall metal atomic ratio controlled. The crosslinker and amino silane form the primary protective network, with the organometallic compound providing enhanced but limited metal content for barrier performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive layer with a 3D network structure provides thermal stability, improved peel strength, and protection against metal oxidation, ensuring reliable bonding between metals and resins in electronic devices, such as semiconductor packaging.
Implementation Method 1
The adhesive forms an adhesive layer having 3-dimensional (3D) networks between the metals and resins
Implementation Method 2
the organometallic compounds are able to prevent the adhesive layer from damages caused by moisture, oxygen and high temperature
Data Source
AI summary
An adhesive for joining metals and resins is disclosed. The adhesive comprises 0.0001˜3 wt. % of amino silane, 0.0001˜1 wt. % of a crosslinker and 0.0001˜3 wt. % of an organometallic compound. In particular, the adhesive forms an adhesive layer that has a metal atomic ratio less than 50%.