Adhesive Layer Segmentation for Semiconductor Substrate Separation

Solution Overview

Problem

The existing manufacturing methods for semiconductor devices face challenges in efficiently separating substrates due to the strong bonding strength of adhesives used, which increases the time and labor required for peeling the support substrate from the device substrate during the polishing process.

Innovation Solution

A manufacturing method involving a first adhesive layer with thermal plasticity on the device substrate and a second adhesive layer with thermosetting properties on the support substrate, where a circular notched part is formed along the outer perimeter of the second adhesive layer to facilitate easy separation by applying a physical force, allowing for a relatively weak interface between the first and second adhesive layers to be peeled, thereby reducing the time and effort needed for substrate separation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Stability of the object's composition

If a high bonding strength adhesive is used to stably support the device substrate on the support substrate during polishing, then the stability of the device substrate is improved, but the time and labor required for peeling the device substrate from the support substrate increases

Engineering Contradiction:

Improvestability of device substrateVSAvoidpeeling time

Core Design Contradiction:

Stability of the object's compositionVSLoss of time

Solution Approach 1:

The adhesive system is segmented into two distinct layers: a first adhesive layer with high bonding strength for stable support during polishing, and a second adhesive layer with low bonding strength for easy separation. This segmentation allows each layer to perform its specific function optimally without compromising the other.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the adhesive system have different bonding strengths tailored to their specific functions. The first adhesive layer (near device substrate) has high bonding strength for stability, while the second adhesive layer (near support substrate) has low bonding strength for easy peeling. This local differentiation resolves the contradiction between stability and ease of separation.

Inventive Principle:

Principle #3Local quality

2Stability of the object's composition

If a high bonding strength adhesive is used to stably support the device substrate on the support substrate during polishing, then the stability of the device substrate is improved, but the labor required for peeling the device substrate from the support substrate increases

Engineering Contradiction:

Improvestability of device substrateVSAvoidease of separation

Core Design Contradiction:

Stability of the object's compositionVSEase of operation

Solution Approach 1:

The adhesive system is segmented into two distinct layers: a first adhesive layer with high bonding strength for stable support during polishing, and a second adhesive layer with low bonding strength for easy separation. This segmentation allows each layer to perform its specific function optimally without compromising the other.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the adhesive system have different bonding strengths tailored to their specific functions. The first adhesive layer (near device substrate) has high bonding strength for stability, while the second adhesive layer (near support substrate) has low bonding strength for easy peeling. This local differentiation resolves the contradiction between stability and ease of separation.

Inventive Principle:

Principle #3Local quality

3Manufacturing precision

If the device substrate is thinned in a polishing process, then the device substrate can be processed, but the support substrate becomes difficult to remove due to strong adhesive bonding

Engineering Contradiction:

Improvesubstrate thinning precisionVSAvoidease of support substrate removal

Core Design Contradiction:

Manufacturing precisionVSEase of operation

Solution Approach 1:

The adhesive system is segmented into two distinct layers: a first adhesive layer with high bonding strength for stable support during polishing, and a second adhesive layer with low bonding strength for easy separation. This segmentation allows each layer to perform its specific function optimally without compromising the other.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the adhesive system have different bonding strengths tailored to their specific functions. The first adhesive layer (near device substrate) has high bonding strength for stability, while the second adhesive layer (near support substrate) has low bonding strength for easy peeling. This local differentiation resolves the contradiction between stability and ease of separation.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method enables the efficient and timely separation of the device substrate from the support substrate, suppressing deformation during heat treatment and reducing the yield rate decline, while allowing for the reuse of the support substrate without damage.

Implementation Method 1

a first adhesive layer with thermal plasticity on the device substrate

Methodology Applied

Scientific EffectThermal plasticity: Plasticity

Implementation Method 2

a second adhesive layer with thermosetting properties on the support substrate

Methodology Applied

Scientific EffectThermosetting: Chemical Bonding

Data Source

PatentUS8975160B2Manufacturing method for semiconductor device

Publication Date: 2015.03.10 KIOXIA CORP

AI summary

According to one embodiment, a first adhesive layer is formed on one major surface of a first substrate. The first substrate and a second substrate are adhered using a second adhesive layer that has thermosetting properties and covers the first adhesive layer, wherein a bonding strength between the second substrate is greater than a bonding strength between the second substrate and the first adhesive layer. The other major surface of the first substrate is polished, and the first substrate is thinned. A physical force is then applied to peripheral parts of the second adhesive layer, and a circular notched part is formed along the outer perimeter of the second adhesive layer to separate the first substrate and the second substrate at the interface between the first adhesive layer and the second adhesive layer.