Adhesive Layer Surface Roughness Measurement for MEMS Bonding

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Solution Overview

Problem

In the manufacturing of joined bodies with microstructures, such as MEMS devices and liquid ejecting heads, uneven adhesive application and air bubbles can lead to bonding failures, resulting in separation or leakage issues.

Innovation Solution

A manufacturing method that involves forming an adhesive layer, adjusting its viscosity, and measuring the surface roughness of the adhesive layer before transcribing it onto the structures, ensuring the adhesive layer is smooth and evenly applied to prevent bonding failures.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If adhesive is applied to a film and then transcribed to structures, then the adhesive can be transferred to the micro structures, but application unevenness occurs causing air bubbles and bonding failure

Engineering Contradiction:
Improveadhesive application uniformityVSAvoidbonding reliability
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The patent applies preliminary action by measuring the surface roughness of the adhesive layer before transcribing it to the structures. This allows detection of application unevenness in advance, enabling corrective actions to be taken before the adhesive is transferred, thus preventing air bubbles and bonding failures in the final product

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent implements feedback by using surface roughness measurement to monitor the quality of the adhesive layer. The measurement results provide feedback on application uniformity, allowing the process to be adjusted to maintain consistent adhesive quality and prevent bonding defects

Inventive Principle:
Principle #23Feedback

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method effectively suppresses bonding failures, improves joining reliability, and enhances manufacturing efficiency by ensuring accurate surface roughness measurement and adhesive layer thickness, reducing the risk of separation or leakage in the joined body.

Implementation Method 1

measuring surface roughness of the adhesive layer on the medium in a stage before the transcribing is performed

Methodology Applied
Scientific EffectLight reflection: Reflection

Data Source

PatentUS10207484B2Manufacturing method of joined body, manufacturing method of MEMS device, manufacturing method of liquid ejecting head, and manufacturing device of joined body
Publication Date: 2019.02.19 SEIKO EPSON CORP
  • US10207484B2 patent drawing
  • US10207484B2 patent drawing
  • US10207484B2 patent drawing

AI summary

A manufacturing method of a joined body in which a plurality of structures are joined to each other, the method including forming of an adhesive layer on one face of a medium; adjusting of viscosity of the adhesive layer formed in the forming of the adhesive layer; transcribing the adhesive layer of which viscosity is adjusted in the adjusting of viscosity to the structure; and measuring of surface roughness of the adhesive layer on a transcribing film in a stage before the transcribing.