Thermoplastic Adhesive Layer Transfer for Heat-Sensitive Substrates
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Solution Overview
Problem
Conventional methods face challenges in depositing an adhesive layer on substrates with electronic components due to heat treatment limitations, wettability issues, material incompatibility, and topography problems, making it difficult to apply a thermoplastic polymer adhesive layer effectively.
Innovation Solution
A method involving the transfer of a thermoplastic polymer adhesive layer from one substrate to another by first depositing a non-stick layer on the periphery of the first substrate, followed by an adhesive layer on the central zone, and then transferring this configuration to a second substrate using thermocompression, allowing the adhesive layer to adhere only to the periphery and be easily peeled off.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If heat treatment is applied to form the adhesive layer, then the adhesive layer can be formed, but the electronic components or substrate cannot support the heat treatment
Solution Approach 1:
The substrate surface is divided into a central area and a peripheral area, with different treatments applied to each region. The peripheral area receives the non-stick layer while the central area remains available for adhesive deposition, allowing process differentiation that avoids heat treatment of the entire substrate including sensitive electronic components
Solution Approach 2:
A non-stick layer is deposited on the peripheral area of the substrate to act as an intermediary that prevents adhesive adhesion at the edges. This intermediary layer enables selective adhesive placement on the central area without requiring heat treatment of the entire substrate, thereby protecting electronic components
2Ease of manufacture
If liquid formulation is deposited on the substrate, then the adhesive layer can be formed, but the substrate has insufficient wettability to ensure homogeneous deposition
Solution Approach 1:
Different surface properties are applied to different regions of the substrate. The peripheral area is treated with a non-stick layer creating low surface energy, while the central area maintains or receives treatment for high wettability, ensuring homogeneous adhesive deposition only where needed
3Ease of manufacture
If adhesive layer is deposited on the substrate, then the temporary bonding can be achieved, but the adhesive layer adheres to the temporary substrate and cannot be easily removed
Solution Approach 1:
The substrate is given non-uniform surface properties: the peripheral area has a non-stick layer that prevents adhesive adhesion, while the central area has adhesive-compatible properties. This ensures the adhesive layer can be easily peeled off from the peripheral area during removal, facilitating easy detachment of the temporary substrate
Solution Approach 2:
Instead of making the entire substrate non-stick to facilitate removal, the invention applies the non-stick property only to the peripheral area. This inverted approach allows the adhesive to bond in the central area while enabling easy removal through the peripheral non-stick zone
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables efficient transfer and easy attachment of the adhesive layer to another substrate, overcoming previous deposition challenges and ensuring the adhesive layer adheres only to the periphery, facilitating easier removal and reuse.
Implementation Method 1
a step of bonding the first substrate and the second substrate consisting of thermo-compressing the upper face of the first substrate onto the upper face of the second substrate
Implementation Method 2
a step of depositing on a first substrate a non-stick layer, this layer being deposited on the periphery of the upper face of said substrate
Data Source
Figure 1
Figure 2A~2F
AI summary
The invention relates to a method for transferring an adhesive layer of thermoplastic polymer(s) from a first substrate to a second substrate comprising the following steps: - a step of depositing a non-stick layer onto a first substrate, this layer being deposited on the periphery of the upper face of said substrate, called the peripheral layer, thus leaving on said upper face an area devoid of said layer, called the central area; - a step of depositing a thermoplastic polymer(s) adhesive layer onto said central area; - a step of depositing a non-stick layer onto a second substrate, this layer being deposited on the upper face of the second substrate excluding its periphery, said periphery thus being devoid of said non-stick layer; - a step of bonding the first substrate and the second substrate consisting of thermo-compressing the upper face of the first substrate onto the upper face of the second substrate;-a step of removing the first substrate, whereby the second substrate remains, the upper face of which is covered by the adhesive layer of thermoplastic polymer(s).