Adhesive Membrane Handling Device for Thin Wafer Planarization
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Solution Overview
Problem
Existing methods for handling and transporting extremely thin wafers with thicknesses of 2 to 80 μm are inadequate due to their susceptibility to damage and warping, as they are not gentle enough and often lead to fracture, especially when trying to fix and transport wafers with non-flat surfaces.
Innovation Solution
A handling device utilizing an adhesive membrane with a changeable volume workspace, where the pressure can be controlled to adjust the contact surface area with the wafer, minimizing force introduction and allowing for gradual force application to prevent damage and planarization of the wafer, using a flexible adhesive membrane that can expand or contract to accommodate the wafer's shape.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If standard fixing methods (vacuum grooves, clamping, adhesive film) are used for extremely thin wafers, then the wafer can be fixed and transported, but the wafer is highly susceptible to fracture and damage due to one-sided force introduction along the crystalline structure
Solution Approach 1:
An adhesive membrane serves as an intermediary between the handling device and the wafer. This membrane distributes forces uniformly across the wafer surface through its flexibility, preventing concentrated stress points that would cause fracture along the crystalline structure. The membrane acts as a buffer that mediates the interaction between the rigid handling device and the fragile wafer.
Solution Approach 2:
The adhesive membrane's physical state is changed by controlling the pressure in the changeable volume workspace. By adjusting pressure, the membrane transitions between states of higher and lower adhesion to the wafer surface, enabling gentle fixation and controlled release without causing damage. This dynamic parameter change allows adaptation to the wafer's fragile nature.
2Ease of operation
If extreme thin wafers with thickness of 2 to 80 μm are fixed using conventional methods, then transport is possible, but the undulated surface and warping prevent proper fixing and planarisation
Solution Approach 1:
The handling device incorporates a changeable volume workspace that allows dynamic adjustment of the adhesive membrane's contact with the wafer. This dynamic system can adapt to undulated surfaces by modifying the workspace volume, enabling the membrane to conform to and gradually planarise the wafer surface during fixation rather than requiring pre-flatness.
3Productivity
If force is applied quickly to fix the wafer, then the fixing process is fast, but the abrupt force introduction increases the risk of wafer fracture
Solution Approach 1:
The fixation process uses periodic action by controlling pressure in stages. Pressurising medium is supplied in a controlled manner to gradually increase contact between the adhesive membrane and the wafer surface. This staged, periodic application of force allows rapid overall fixation while preventing abrupt force introduction that would cause fracture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables gentle and secure handling and transportation of extremely thin wafers, reducing the risk of fracture while allowing for planarization, and is also suitable for standard wafers, ensuring minimal force is applied along the crystalline structure.
Implementation Method 1
an adhesive membrane is provided which is part of a workspace with a changeable volume
Implementation Method 2
By increasing the pressure in the workspace, i.e. by supplying a pressurising medium into the workspace by way of at least one supply channel, the contact surface can be increased or reduced
Data Source
AI summary
The invention relates to a handling device and to a handling method for wafers, in particular for wafers with a thickness of less than 100 μm. According to the invention it is provided that an adhesive membrane is arranged so as to delimit at least one workspace, the volume of which can be changed by supplying or removing pressurising medium, and in that the size of the contact surface between the adhesive membrane and the wafer can be adjusted by changing the workspace volume.