Conductive Adhesive Interconnect for 3D Memory Substrate Alignment
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Solution Overview
Problem
The manufacturing process of three-dimensional semiconductor memory devices faces challenges in stability due to the complexity of integrating memory cells and peripheral circuits, requiring improved techniques for connecting conductive contact patterns across substrates.
Innovation Solution
A semiconductor memory device and manufacturing method involving a first substrate with a peripheral circuit and conductive contact patterns, a second substrate with a memory cell array, and conductive adhesive patterns filling grooves in an insulating layer to connect the contact patterns, ensuring alignment and stability through controlled viscosity and curing of the adhesive material.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If three-dimensional semiconductor memory devices are manufactured with integrated memory cells and peripheral circuits, then the degree of integration is improved, but the manufacturing process stability deteriorates
Solution Approach 1:
The device is divided into two separate substrates: a first substrate containing the peripheral circuit and a second substrate containing the memory cell array. This segmentation allows each substrate to be manufactured and processed independently, improving manufacturing stability while maintaining high integration when the substrates are connected through the conductive adhesive patterns that electrically connect the contact patterns between substrates.
Solution Approach 2:
A conductive adhesive pattern is introduced as an intermediary element to connect the first conductive contact pattern on the first substrate with the second conductive contact pattern on the second substrate. This intermediary component facilitates electrical connection between the separated substrates while allowing for stress absorption and alignment tolerance, thereby maintaining manufacturing process stability.
2Adaptability or versatility
If conductive contact patterns are connected across substrates to achieve three-dimensional integration, then the degree of integration is improved, but stress on contact patterns increases causing manufacturing instability
Solution Approach 1:
The conductive adhesive pattern serves as a mediator between the first and second conductive contact patterns. It absorbs mechanical stress that would otherwise be transmitted directly between the contact patterns, protecting them from damage while enabling electrical connection across the substrate interface.
Solution Approach 2:
The conductive adhesive pattern is formed using a composite material that combines conductive properties with adhesive properties. This composite material enables both electrical connection and mechanical bonding, while its material composition allows for stress absorption and protection of the contact patterns.
3Adaptability or versatility
If substrates are aligned and connected to form three-dimensional structure, then the degree of integration is improved, but alignment precision becomes more difficult to achieve
Solution Approach 1:
The conductive adhesive pattern acts as an intermediary layer that provides alignment tolerance. The adhesive nature of this layer allows for slight misalignments between the first and second substrates while still achieving effective electrical connection, thereby reducing the stringency of alignment precision requirements.
Solution Approach 2:
The conductive adhesive material undergoes a parameter change from a liquid or paste state during application to a solidified state after curing. This phase transition allows the material to flow and fill gaps during alignment, then固化 to provide stable mechanical and electrical connection, accommodating variations in alignment precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the stability and integration of the semiconductor memory device by reducing stress on conductive contact patterns and improving alignment, thereby stabilizing the manufacturing process and increasing the degree of integration.
Implementation Method 1
conductive adhesive patterns filling the grooves to connect the second conductive contact patterns to the first conductive contact patterns
Data Source
AI summary
The semiconductor memory device includes: a first substrate including a peripheral circuit, first conductive contact patterns connected to the peripheral circuit, and a first upper insulating layer having grooves exposing the first conductive contact patterns; a second substrate including a memory cell array, a second upper insulating layer disposed on the memory cell array, the second upper insulating layer formed between the memory cell array and the first upper insulating layer, second conductive contact patterns protruding through the second upper insulating layer into an opening of the grooves; and conductive adhesive patterns filling the grooves to connect the second conductive contact patterns to the first conductive contact patterns.