3D Adhesive Device Embedding Microelectronics

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing microelectronic systems for monitoring physiological or neurological conditions suffer from skin irritation, discomfort, and detachment issues due to occlusive adhesives, bulkiness, and the need for wired connections, which limits their usability during physical activity and prolonged use.

Innovation Solution

A three-dimensional adhesive device with a microelectronic system embedded in a pressure-sensitive adhesive body, featuring a varying thickness and beveled edges for comfort and stability, using thermoplastic or chemically curing adhesives that provide protection against moisture and mechanical damage, and allowing for wireless communication and reusable components.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If occlusive adhesives are used to attach microelectronic systems to the skin, then attachment reliability is improved, but skin irritation increases

Engineering Contradiction:
Improveattachment reliabilityVSAvoidskin irritation
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The adhesive is formulated as a micro-porous material that allows skin respiration and moisture vapor transmission. The porous structure enables gas exchange while maintaining adhesive bonding, thereby preventing skin irritation and maceration that occur with occlusive adhesives, while still providing reliable attachment of the microelectronic system to the skin.

Inventive Principle:
Principle #31Porous materials

2Reliability

If wired connections are used to connect sensors to monitoring devices, then signal transmission reliability is improved, but ease of operation deteriorates due to movement restrictions

Engineering Contradiction:
Improvesignal transmission reliabilityVSAvoidease of movement
Core Design Contradiction:
ReliabilityVSEase of operation

Solution Approach 1:

The patent replaces mechanical wired connections with wireless communication technology. The microelectronic system incorporates wireless transmitters that communicate with external monitoring devices through electromagnetic fields, eliminating the need for physical wire connections. This substitution maintains signal transmission reliability while completely removing movement restrictions, allowing patients to engage in physical activities freely.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

3Strength

If bulky devices are used for physiological monitoring, then protection against mechanical damage is improved, but comfort deteriorates

Engineering Contradiction:
Improveprotection against mechanical damageVSAvoiddiscomfort
Core Design Contradiction:
StrengthVSObject-affected harmful factors

Solution Approach 1:

The patent transitions from bulky three-dimensional protective housings to thin-film two-dimensional structures. The microelectronic system is constructed using flexible printed circuit boards and thin-film encapsulation layers that provide mechanical protection while maintaining extreme thinness and flexibility. This dimensional reduction eliminates the bulkiness that causes discomfort, allowing the device to conform closely to the skin surface without creating pressure points or visible protrusions.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

4Ease of manufacture

If disposable adhesive devices are used, then ease of manufacture is improved, but loss of substance increases due to discarding functional components

Engineering Contradiction:
Improveease of manufactureVSAvoidloss of functional components
Core Design Contradiction:
Ease of manufactureVSLoss of substance

Solution Approach 1:

The patent divides the adhesive device into two separable segments: a disposable adhesive portion and a reusable microelectronic system portion. The microelectronic system can be detached from the adhesive layer after use and reused with a new adhesive application. This segmentation allows the expensive functional electronic components to be recovered and reused multiple times, reducing waste and loss of substance, while the simple adhesive portion remains easy to manufacture as a disposable component.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS11864916B2Three-dimensional adhesive device having a microelectronic system embedded therein
Publication Date: 2024.01.09 BRAEMAR MANUFACTURING LLC
  • US11864916B2 patent drawing
  • US11864916B2 patent drawing
  • US11864916B2 patent drawing

AI summary

The present invention relates to a three-dimensional adhesive device to be attached to the body surface of a mammal comprising a microelectronic sensing system characterized by (a) a three-dimensional adhesive body made of a pressure sensitive adhesive having an upper surface and a bottom surface; (b) a microelectronic system embedded in the body of the pressure sensitive adhesive; (c) one or more cover layer(s) attached to the upper surface; and (d) optionally a release liner releasable attached to the bottom surface of the adhesive device. Suitably the microelectronic system is a microelectronic sensing system capable of sensing physical input such as pressure, vibration, sound, electrical activity (e.g. from muscle activity), tension, blood-flow, moisture, temperature, enzyme activity, bacteria, pH, blood sugar, conductivity, resistance, capacitance, inductance or other chemical, biochemical, biological, mechanical or electrical properties.