Adhesive Cable Tie Mount with Nubs for Bond-Line Thickness Control

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Solution Overview

Problem

Conventional cable tie mounts with adhesive bonding surfaces face issues of inconsistent adhesive thickness and excess weight due to excess adhesive, which is problematic for weight-sensitive applications like aerospace and space-bound vehicles, and lack features to achieve optimal bond-line thickness without glass beads.

Innovation Solution

A cable tie mount with a bottom surface featuring a plurality of nubs or protrusions of predefined dimensions to define the bond-line thickness, allowing for optimal adhesive application without glass beads, and optionally including grooves for weight reduction and a single-piece molded top and bottom surface for structural integrity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If adhesive is applied without predefined thickness control, then adhesive application is simple, but adhesive thickness becomes inconsistent and excess adhesive increases weight

Engineering Contradiction:
Improveadhesive thickness consistencyVSAvoidbonding surface structure
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The bonding surface is pre-formed with protrusions during the molding process to define the adhesive layer thickness before adhesive application. This preliminary structural preparation ensures consistent adhesive thickness without requiring complex application controls or post-processing adjustments.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The bonding surface structure is modified by adding protrusions that physically constrain the adhesive layer thickness. This changes the geometric parameters of the bonding interface, ensuring that the adhesive layer maintains a predefined thickness regardless of application variations.

Inventive Principle:
Principle #35Parameter changes

2Manufacturing precision

If glass beads are added to adhesive to control thickness, then dimensional standard is provided, but adhesive weight increases and curing time increases

Engineering Contradiction:
Improveadhesive layer thickness controlVSAvoidcable tie mount weight
Core Design Contradiction:
Manufacturing precisionVSWeight of moving object

Solution Approach 1:

The thickness control function is extracted from the adhesive formulation (glass beads) and transferred to the bonding surface structure (protrusions). This removes the need for heavy glass bead additives while maintaining precise thickness control, thereby reducing overall weight.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The protrusions on the bonding surface act as an intermediary structure that mediates between the adhesive application and the final bonded assembly. They provide the thickness control function without requiring the adhesive itself to contain thickness-defining additives like glass beads.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Reliability

If applicator is used to apply adhesive and pressure, then proper seating is ensured, but installation time and process complexity increase

Engineering Contradiction:
Improvecable tie mount seating qualityVSAvoidinstallation speed
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The bonding surface protrusions are designed to self-align and self-seat the cable tie mount during application. The protrusions physically guide the mounting process and ensure proper positioning without requiring external applicators to apply pressure or adjust alignment, thereby speeding up installation.

Inventive Principle:
Principle #25Self-service

Solution Approach 2:

The protrusions are pre-formed on the bonding surface to create a self-aligning interface. This preliminary structural preparation ensures that when the cable tie mount is applied, it naturally seats correctly on the protrusions, eliminating the need for subsequent alignment adjustments or pressure application tools.

Inventive Principle:
Principle #10Preliminary action

4Reliability

If excess adhesive is applied to ensure coverage, then bonding coverage is sufficient, but weight increases cumulatively in large-scale applications

Engineering Contradiction:
Improveadhesive bonding coverageVSAvoidcumulative weight of cable tie mounts
Core Design Contradiction:
ReliabilityVSWeight of moving object

Solution Approach 1:

The bonding surface geometry is changed by adding protrusions that define a specific adhesive layer thickness. This parameter change ensures that the adhesive layer is neither too thin (insufficient coverage) nor too thick (excess weight), providing optimal coverage with minimal adhesive material.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The protrusions create localized adhesive pockets between themselves and the mounting surface. This localizes the adhesive application to specific areas where bonding is needed, ensuring sufficient coverage while minimizing adhesive in non-critical areas, thereby reducing overall weight.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables consistent and reduced adhesive thickness, minimizing weight and production costs, while maintaining structural integrity and allowing for faster installation without an applicator, achieving cumulative weight reduction in large-scale applications.

Implementation Method 1

A cable tie mount with a bottom surface featuring a plurality of nubs or protrusions of predefined dimensions to define the bond-line thickness, allowing for optimal adhesive application without glass beads

Methodology Applied
Scientific EffectAdhesive bonding: Adhesive

Data Source

PatentEP4465464A1Adhesive based cable tie mount
Publication Date: 2024.11.20 TE CONNECTIVITY INDIA LTD
  • EP4465464A1 patent drawingFigure 1~3
  • EP4465464A1 patent drawing
  • EP4465464A1 patent drawing

AI summary

The present invention relates to an adhesive based cable tie mount (100) for attaching on a mounting surface to facilitate the mounting of cable ties to tie one or more cables or wires. The cable tie mount (100) comprises a top surface (102), a bottom surface (104), and a receiving cut-out portion (106) formed between said top surface and said bottom surface. The top surface comprises a first end (108), a second end (110), and a central portion (112) for placing said cables or wires. The bottom surface is configured to be attached with said mounting surface. A plurality of nubs (114) of predefined dimension are disposed in a spaced apart manner on said bottom surface. The nubs are configured to define a bond-line thickness between said bottom surface and sad mounting surface. The receiving cut-out portion is formed to accommodate said cable ties therein.