Adhesive Optical Structure for LED Light Interference Reduction
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Solution Overview
Problem
Current semiconductor devices face challenges in improving performance and quality, particularly in the integration and optimization of light-emitting diodes within a semiconductor device structure to enhance display and light-emitting quality.
Innovation Solution
A semiconductor device design that includes a first substrate with a light-emitting diode, an insulating layer, an adhesive structure, and an optical structure, along with a second substrate, where the optical structure is in contact with the adhesive structure to reduce light interference and improve color purity and display quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If light-emitting diodes are integrated into semiconductor device structure, then display quality and light-emitting performance are improved, but light interference between elements increases
Solution Approach 1:
An adhesive structure with optical properties is introduced as an intermediary between light-emitting diodes and the substrate. This adhesive structure acts as a mediator to manage light propagation, reducing light interference between adjacent light-emitting elements while maintaining effective light emission. The adhesive structure's refractive index and optical characteristics are specifically designed to control light behavior in the gap regions.
Solution Approach 2:
The adhesive structure is selectively positioned in specific regions between light-emitting elements rather than uniformly across the entire device. This local application targets the specific areas where light interference occurs, applying optical control properties where needed while leaving other regions unaffected. The adhesive structure's optical characteristics are optimized for the local light interference conditions.
2Manufacturing precision
If adhesive structure is added between substrate and light-emitting diode, then light interference is reduced and color purity is enhanced, but device complexity increases
Solution Approach 1:
The adhesive structure serves multiple functions simultaneously: it provides mechanical adhesion between the substrate and light-emitting diodes, manages optical properties to reduce light interference, and enhances color purity through its specific refractive index characteristics. By combining these functions into a single component, the design avoids adding separate dedicated structures for each function, thereby limiting the increase in device complexity.
Solution Approach 2:
The adhesive structure merges the mechanical bonding function with the optical management function into a single integrated component. Rather than having separate adhesive layers and optical control structures, the design combines these functions into one adhesive structure that performs both mechanical and optical roles, simplifying the overall device architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively reduces light interference between light-emitting elements, enhances color purity, and improves the overall display and light-emitting quality by strategically positioning the optical structure in relation to the light-emitting diodes and conversion layers.
Implementation Method 1
the optical structure is in contact with the adhesive structure to reduce light interference and improve color purity and display quality
Data Source
AI summary
A semiconductor device is provided. The semiconductor device includes a first substrate. The semiconductor device also includes a first light-emitting diode on the first substrate. The semiconductor device further includes a first insulating layer on the first substrate and adjacent to the first light-emitting diode. In addition, the semiconductor device includes an adhesive structure on the first insulating layer. The adhesive structure includes a first side facing the first light-emitting diode and a second side opposite to the first side. The semiconductor device also includes a second substrate disposed on the adhesive structure. The semiconductor device further includes an optical structure in contact with at least one of the first side and the second side.


