Adhesive Particle Shield for Lithography
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current methods fail to effectively protect lithographic surfaces, such as reticles and wafers, from particulate matter deposition in advanced lithographic processes, especially in sub-atmospheric pressure environments, without compromising performance or contaminating optical elements.
Innovation Solution
A strategically positioned adhesive particle shield with a mounting panel and adhesive film coated with a low-outgassing, thermally stable material that captures particles via adhesive forces and can incorporate cooling for enhanced particle attraction through thermophoresis, designed for use in vacuum systems and photolithographic processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If adhesive particle shields are used to capture particles, then particle contamination on critical surfaces is reduced, but the adhesive coating may outgas and contaminate the vacuum environment
Solution Approach 1:
The adhesive coating is specifically selected and formulated to have low outgassing properties, changing the material parameter to resolve the contradiction between particle capture effectiveness and vacuum environment compatibility
Solution Approach 2:
The adhesive material is chosen to be compatible with vacuum environments, effectively creating an inert environment that prevents outgassing contamination while maintaining particle capture functionality
2Object-affected harmful factors
If cooling means are added to enhance particle attraction through thermophoresis, then particle capture effectiveness is improved, but device complexity increases
Solution Approach 1:
The cooling means acts as an intermediary mechanism that creates temperature gradients to attract particles via thermophoresis, enhancing particle capture without requiring direct contact or complex mechanical structures
Solution Approach 2:
The invention replaces purely mechanical particle capture methods with a thermal field-based approach (thermophoresis), substituting mechanical complexity with thermal field control
3Object-affected harmful factors
If the adhesive film is positioned to intercept particles in hard-to-reach areas, then protection of critical surfaces is improved, but accessibility for maintenance and replacement becomes more difficult
Solution Approach 1:
The adhesive particle shield is designed as a segmented, modular structure that can be divided into separate sections, allowing individual segments to be accessed, removed, and replaced without disassembling the entire shield system
Solution Approach 2:
The shield incorporates movable or adjustable components that allow dynamic reconfiguration, enabling maintenance personnel to access critical areas for particle shield replacement while maintaining optimal particle interception positioning during operation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Significantly reduces particle contamination on critical surfaces, maintaining defect-free conditions and improving the quality of microelectronic devices by effectively intercepting and capturing particles in various lithographic and coating processes, including extreme ultraviolet lithography.
Implementation Method 1
the outer surface of the film has an adhesive coating disposed thereon to capture particles contacting the outer surface
Implementation Method 2
the adhesive particle shield can incorporate cooling means to attract particles via the thermophoresis effect
Data Source
AI summary
An efficient device for capturing fast moving particles has an adhesive particle shield that includes (i) a mounting panel and (ii) a film that is attached to the mounting panel wherein the outer surface of the film has an adhesive coating disposed thereon to capture particles contacting the outer surface. The shield can be employed to maintain a substantially particle free environment such as in photolithographic systems having critical surfaces, such as wafers, masks, and optics and in the tools used to make these components, that are sensitive to particle contamination. The shield can be portable to be positioned in hard-to-reach areas of a photolithography machine. The adhesive particle shield can incorporate cooling means to attract particles via the thermophoresis effect.