Adhesive Paste Die Attach for Semiconductor Lead Frames
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Solution Overview
Problem
Die attach films (DAFs) in semiconductor packaging are prone to delamination and cannot withstand high wire bond temperatures, leading to production quality issues and increased costs due to their susceptibility to delamination and high costs.
Innovation Solution
Adhesive paste is used to attach semiconductor dies to lead frames, providing a more reliable and cost-effective alternative by controlling the amount and type of adhesive to ensure maximum coverage without overflowing, and using thermally or electrically conducting materials as needed.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If die attach film (DAF) is used to attach semiconductor die to lead frame, then the attachment process is easy and simple, but the bond integrity deteriorates due to delamination at high temperatures and the cost increases
Solution Approach 1:
The patent changes the material parameters by transitioning from die attach film to adhesive paste with different thermal and mechanical properties. The adhesive paste is formulated to maintain bond integrity at high wire bond temperatures while providing sufficient adhesion strength, thereby resolving the contradiction between ease of manufacture and bond reliability.
Solution Approach 2:
The patent employs composite adhesive paste materials that combine multiple functional properties: adhesion to both die and lead frame, thermal conductivity for high-temperature resistance, and electrical conductivity or insulation as needed. This composite approach enables the material to simultaneously provide easy application and reliable high-temperature bonding.
2Ease of manufacture
If die attach film (DAF) is used to attach semiconductor die to lead frame, then the attachment process is simple, but the temperature resistance deteriorates due to inability to withstand high wire bond temperatures
Solution Approach 1:
The patent modifies the thermal parameters by replacing DAF with adhesive paste formulated to withstand high wire bond temperatures. The adhesive paste maintains its bonding properties and structural integrity at elevated temperatures where DAF would fail, thus resolving the temperature resistance issue while preserving manufacturing simplicity.
Solution Approach 2:
The patent adopts a cost-effective adhesive paste material that provides sufficient service life for the packaging process without requiring the expensive properties of DAF. The adhesive paste achieves the necessary temperature resistance and bonding durability at lower cost, replacing the disposable nature of DAF with a more economical permanent bond solution.
3Ease of operation
If die attach film (DAF) is used to attach semiconductor die to lead frame, then the application process is easy, but the production cost increases due to high material cost and additional production costs from delamination
Solution Approach 1:
The patent replaces expensive die attach film with a more economical adhesive paste that provides equivalent or superior performance. The adhesive paste reduces material costs while eliminating additional production costs associated with delamination repairs and rework, thereby reducing total production cost while maintaining ease of application.
Solution Approach 2:
The patent extracts and eliminates the problematic DAF layer from the packaging process, removing the source of delamination issues and associated costs. By taking out the DAF and replacing it with adhesive paste directly applied to the die or lead frame, the process simplifies and reduces overall production costs while maintaining operational ease.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The use of adhesive paste enhances the integrity of the bond between the die and lead frame, reduces delamination, and lowers production costs by providing a material that can withstand higher temperatures and improve manufacturing processes.
Implementation Method 1
adhesive paste to bind a semiconductor die to a lead frame
Implementation Method 2
using thermally or electrically conducting materials as needed
Implementation Method 3
using thermally or electrically conducting materials as needed
Data Source
AI summary
According to various embodiments, systems and methods for packaging a semiconductor device are provided. The disclosure discusses a semiconductor die having a top side and a bottom side that is disposed on a lead frame. An adhesive paste is then applied to attach the semiconductor die to the lead frame such that the adhesive paste fixes the die to a portion of the lead frame. The adhesive paste may be applied directly between die and the lead frame or may be applied in conjunction with a frame tape.