Adhesive Patch With Microchannel Hydrogel for Wet Skin

The patent replaces chemical adhesion with mechanical adhesion through microchannel structures. The patch surface features arrays of microchannels that physically interlock with skin surface irregularities, providing strong adhesion through mechanical interlocking rather than chemical bonding. This mechanical substitution eliminates the need for chemical adhesives that cause skin damage upon removal.

The patent employs a porous microchannel structure on the patch surface. These microchannels create a three-dimensional porous architecture that increases surface area and enables physical interlocking with the skin. The porous structure provides multiple anchoring points for mechanical adhesion while allowing breathability and reducing stress concentration that would cause skin damage.

The patent applies local quality by creating regions of different wettability on the patch surface. Hydrophobic microchannel structures are strategically positioned to repel water and maintain mechanical interlocking, while hydrophilic regions manage moisture through capillary action. This spatial differentiation of wettability properties allows the patch to maintain adhesion in wet environments while avoiding widespread skin damage.

The patent uses composite materials with different surface energy characteristics. Hydrophobic materials form the microchannel structures that provide mechanical interlocking, while hydrophilic materials are incorporated to manage moisture through capillary wicking. This composite approach combines the advantages of both hydrophobic and hydrophilic properties to maintain reliable adhesion in wet conditions without causing skin damage.