Adhesive Patch Substrate Thickness and Composition
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Solution Overview
Problem
Conventional body surface patches face issues with cumbersome application due to a carrier sheet, reduced fitness to the body surface, and adhesive flow, which affects their handling and adhesion.
Innovation Solution
A body surface patch with a substrate thickness of 20 to 90 μm and an adhesive layer thickness of 40 to 160 μm, containing a radiation curable resin and a hydrophilic polymer compound, eliminating the need for a carrier sheet and enhancing flexibility and elasticity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a carrier sheet is provided on the non-adhesive face of the substrate to increase stiffness, then handling ability during application is improved, but device complexity increases and application work becomes cumbersome
Solution Approach 1:
The invention extracts and removes the carrier sheet from the patch structure, achieving stiffness control through the substrate thickness itself (20-90 μm) rather than adding auxiliary components. This eliminates the complexity of applying and removing a carrier sheet while maintaining adequate handling ability during application.
Solution Approach 2:
The invention changes the physical parameter of substrate thickness to a specific range (20-90 μm) to achieve optimal balance between stiffness for handling and flexibility for body surface conformity, replacing the need for a carrier sheet with precise dimensional control.
2Ease of operation
If a thick or stiff material is used for the substrate or adhesive layer to maintain patch stiffness, then handling ability is improved, but fitness to the body surface is reduced and the patch may separate easily
Solution Approach 1:
The invention specifies precise thickness parameters for the substrate (20-90 μm) and adhesive layer (40-160 μm) to achieve the optimal balance between stiffness for handling and flexibility for body surface conformity. This parameter optimization allows the patch to maintain structural integrity during application while conforming well to the body surface afterward.
Solution Approach 2:
The invention uses a composite structure with specific material composition in the adhesive layer containing a radiation-curable resin and hydrophilic polymer compound, achieving both adequate stiffness and flexibility through material selection rather than simply increasing thickness.
3Adaptability or versatility
If a large amount of plasticizer is added to the adhesive to increase flexibility and elasticity, then fitness to the body surface is improved, but cohesion of the adhesive layer is reduced causing adhesive flow
Solution Approach 1:
The invention employs a composite adhesive system containing a radiation-curable resin and hydrophilic polymer compound. This composite formulation provides the necessary flexibility and elasticity for body surface conformity while maintaining adequate cohesion through the synergistic interaction of the polymer components, eliminating the need for excessive plasticizer addition.
Solution Approach 2:
The invention changes the chemical composition parameters of the adhesive layer by incorporating specific polymer compounds with controlled molecular structures that provide flexibility without compromising cohesion, avoiding the adhesive flow problem associated with high plasticizer content.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The patch achieves high handling ability during application, improved fitness to the body surface, and reduced adhesive flow, ensuring effective adhesion and easy removal without residue.
Implementation Method 1
The adhesive layer contains at least, a radiation curable resin and a hydrophilic polymer compound
Data Source
AI summary
A body surface patch is provided that includes: a substrate having a top face and a bottom face; an adhesive layer covering at least part of the bottom face of the substrate; and a releasable adhesive protecting film covering the adhesive layer. The substrate has a thickness of 20 to 90 μm and the adhesive layer has a thickness of 40 to 160 μm. The adhesive layer at least contains a radiation curable resin and a hydrophilic polymer compound.