Adhesive Pin-Flange Assembly for Precise Casing Alignment

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Solution Overview

Problem

The challenge in adhering metal components of electronic device casings is accurately aligning adherend members without adhesive flow issues, which often results in sink marks or bubbles, making precise positional alignment difficult.

Innovation Solution

An adhesive member with a first pin portion, a second pin portion, and a flange portion is used, where the pins are inserted into corresponding holes in the adherend members to facilitate alignment, and the flange portion, formed from adhesive, is used to create a strong bond while allowing for temporary adjustment and sealing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If adhesive is applied to one adherend member and the other adherend member is bonded via the adhesive, then adhesion is achieved, but positional alignment becomes difficult and requires additional positioning pins or fixtures

Engineering Contradiction:
Improveadhesion strengthVSAvoidpositional alignment precision
Core Design Contradiction:
StrengthVSManufacturing precision

Solution Approach 1:

The patent combines the adhesive application function and the positioning function into a single integrated adhesive member. The adhesive member includes a positioning pin portion that inserts into a positioning hole to provide precise positioning, while also having adhesive application portions on its surface that apply adhesive to the adherend member. This merging eliminates the need for separate positioning pins or fixtures and solves the contradiction between achieving strong adhesion and maintaining positioning precision.

Inventive Principle:
Principle #5Merging (Combining)

2Manufacturing precision

If the positions of adherend members are adjusted after bonding, then positioning can be corrected, but adhesive flow causes insufficient adhesive amount and forms sink marks or bubbles

Engineering Contradiction:
Improvepositional alignment precisionVSAvoidadhesive layer quality
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The patent implements preliminary positioning by providing a positioning pin portion on the adhesive member that inserts into a positioning hole before adhesive bonding occurs. This preliminary action establishes accurate positional alignment in advance, preventing the need for post-bonding adjustments that would cause adhesive flow issues. The positioning is secured before the adhesive sets, ensuring both precision and reliability.

Inventive Principle:
Principle #10Preliminary action

3Manufacturing precision

If additional positioning pins are used to achieve accurate alignment, then positioning precision improves, but device complexity and manufacturing cost increase

Engineering Contradiction:
Improvepositional alignment precisionVSAvoidnumber of components
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent merges the positioning pin function and the adhesive carrier function into a single adhesive member. The adhesive member includes a positioning pin portion for accurate positioning and adhesive application portions for bonding. This integration reduces the number of components, simplifies the device structure, and lowers manufacturing costs while maintaining high positioning precision.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The adhesive member serves multiple functions simultaneously: it acts as a positioning element through its pin portion, as an adhesive carrier through its application portions, and as a bonding agent. This multi-functionality eliminates the need for separate positioning pins and adhesive applications, reducing device complexity while achieving accurate alignment.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method enables accurate and easy positional alignment of adherend members, improving the quality of the bond and sealability of the electronic device casing without additional positioning pins, thus enhancing manufacturing efficiency and reducing costs.

Implementation Method 1

a flange portion which is formed using an adhesive, and is mounted to a side surface of the first pin portion or a side surface of the second pin portion in a flange shape

Methodology Applied
Scientific EffectAdhesion: Adhesive

Data Source

PatentUS11919251B2Adhesive member, adhesion method, and method for manufacturing electronic device casing
Publication Date: 2024.03.05 MITSUBISHI ELECTRIC CORP
  • US11919251B2 patent drawing
  • US11919251B2 patent drawing
  • US11919251B2 patent drawing

AI summary

An adhesive member includes: a first pin portion to be inserted into a first hole formed in a first adherend member; a second pin portion which is to be inserted into a second hole formed in a second adherend member to be adhered to the first adherend member, and is formed coaxially with the first pin portion; and a flange portion which is formed using an adhesive, and is mounted to a side surface of the first pin portion or a side surface of the second pin portion in a flange shape.