Adhesive Composition with Radical Polymerization Regulator
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Solution Overview
Problem
Conventional radical curing adhesives for semiconductor elements and liquid crystal display units have narrow process margins and unstable adhesive strength due to their high reactivity, making it difficult to achieve stable bonding at low temperatures and short curing times, which can lead to damage from excessive heating of surrounding components.
Innovation Solution
A thermoplastic resin-based adhesive composition incorporating a radical polymerizing compound, a radical polymerization initiator, and a radical polymerization regulator, specifically an amine compound with a divalent organic group, to facilitate fast curing at low temperatures while maintaining a wide process margin and stable adhesive strength, and optionally including conductive particles for improved conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If radical curing adhesives are used for fast curing, then curing speed is improved, but process margin becomes narrow and adhesive strength becomes unstable
Solution Approach 1:
The patent introduces a radical polymerization regulator as an intermediary substance that mediates between the radical polymerization initiator and the polymerizing compound. This regulator controls the polymerization reaction rate, preventing it from being too rapid while still enabling fast curing. The regulator acts as a buffer that stabilizes the adhesive strength across varying process conditions while maintaining high curing speed.
Solution Approach 2:
The patent changes the chemical parameters of the adhesive system by adding a radical polymerization regulator that modifies the polymerization kinetics. This parameter change allows the system to achieve fast curing at low temperatures (100-170°C) while maintaining a wide process margin and stable adhesive strength, resolving the contradiction between curing speed and reliability.
2Strength
If high temperature curing is used to achieve strong adhesion, then adhesive strength is improved, but surrounding members are damaged due to excessive heating
Solution Approach 1:
The patent changes the curing temperature parameter from conventional high temperatures (170-250°C) to low temperatures (100-170°C) by using a radical polymerization mechanism with a regulator. This parameter change enables achieving strong adhesive strength while avoiding thermal damage to surrounding members, as the lower curing temperature does not transmit excessive heat to adjacent components.
Solution Approach 2:
The patent replaces the conventional thermosetting resin curing mechanism with a radical polymerization mechanism. This substitution allows curing to proceed at lower temperatures through a different chemical pathway, eliminating the need for high-temperature processing that causes thermal damage to surrounding members.
3Object-affected harmful factors
If low temperature curing is used to protect surrounding members, then thermal damage is reduced, but curing time increases and throughput decreases
Solution Approach 1:
The radical polymerization regulator acts as a mediator that enables fast curing at low temperatures by controlling the reaction kinetics. This intermediary substance allows the system to cure quickly without requiring high temperatures, thus protecting surrounding members while maintaining high throughput and productivity.
Solution Approach 2:
The patent changes multiple parameters simultaneously: lowering the curing temperature while maintaining short curing time (within an hour). This is achieved through the radical polymerization mechanism with a regulator, which enables the system to cure fast at low temperatures, thus improving throughput while protecting surrounding members from thermal damage.
4Speed
If high reactivity radical curing adhesives are used, then curing speed is improved, but process margin becomes narrow making stable bonding difficult
Solution Approach 1:
The radical polymerization regulator serves as an intermediary that controls the reactivity of the system. It prevents the polymerization from being too rapid by regulating the radical generation and consumption rates, thereby widening the process margin while maintaining fast curing speed and enabling stable bonding across varying process conditions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive composition enables rapid curing at low temperatures with a wide process margin, ensuring stable adhesive strength and reduced risk of damage to surrounding components, while also providing conductivity and anisotropic electrical connections.
Implementation Method 1
curing and bonding of such adhesives is accomplished by polymerization reaction of radicals as reactive species
Implementation Method 2
The radical polymerization regulator preferably contains an amine compound having a divalent organic group
Data Source
AI summary
The adhesive composition of the invention comprises a thermoplastic resin, a radical polymerizing compound, a radical polymerization initiator and a radical polymerization regulator. According to the present invention it is possible to provide an adhesive composition, a circuit connecting material, a connection structure for a circuit member and a semiconductor device whereby curing treatment can be carried out with sufficient speed at low temperature, curing treatment can be carried out with a wide process margin, and adequately stable adhesive strength can be obtained.