Adhesive Member Recess Patterns for Display Panel Bonding
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Solution Overview
Problem
Existing display devices face challenges in achieving reliable electrical connections between electronic components and display panels, particularly in maintaining conductivity and simplifying the connection process while preventing oxidation of pads and bumps.
Innovation Solution
An adhesive member with recess patterns on its surface is used to connect electronic components to display panels, featuring a combination of thermal initiators and non-conductive characteristics, which migrates during ultrasonic bonding to ensure reliable contact and prevent oxidation, with specific recess patterns optimizing the area coverage and thickness for improved joint reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If ultrasonic bonding method is used to connect electronic component and display panel, then conductivity and process simplification are improved, but joint reliability may be insufficient without proper adhesive structure
Solution Approach 1:
The adhesive member is segmented with recess patterns that divide the bonding interface into distinct regions. These recesses create multiple contact points between the electronic component and display panel, distributing stress and improving joint reliability while maintaining a relatively simple overall adhesive structure.
Solution Approach 2:
The adhesive member features localized recess patterns at specific bonding regions rather than uniform modification throughout. This local quality approach concentrates the structural enhancement where it is most needed for ultrasonic bonding contact, improving reliability without adding unnecessary complexity to the entire adhesive member.
2Reliability
If recess patterns are added to adhesive member to improve contact, then joint reliability is improved, but manufacturing complexity increases
Solution Approach 1:
The recess patterns are pre-formed in the adhesive member before the bonding process. This preliminary action ensures that the adhesive is already in the optimal configuration for ultrasonic bonding, guaranteeing consistent contact without requiring complex real-time adjustments during manufacturing.
Solution Approach 2:
The recess patterns modify the physical parameters of the adhesive member (depth, area, distribution) to optimize bonding performance. By carefully controlling these parameters within specific ranges, the invention achieves improved contact consistency while keeping the manufacturing process manageable through standardized parameter specifications.
3Strength
If adhesive member area is increased to improve bonding, then joint strength is improved, but oxidation risk of pads and bumps increases
Solution Approach 1:
The adhesive member is segmented into a bonding area with recess patterns and a surrounding non-bonding area. This segmentation allows the bonding region to provide sufficient joint strength while the reduced overall adhesive coverage minimizes the area exposed to oxidation risks, protecting the pads and bumps.
Solution Approach 2:
The adhesive is locally concentrated in specific bonding regions with recess patterns rather than uniformly distributed. This local quality approach provides adequate bonding strength at the critical contact points while reducing the total adhesive area that could contribute to oxidation, thereby protecting sensitive components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive member enhances the reliability of electrical connections by ensuring consistent contact between pads and bumps, preventing oxidation, and simplifying the bonding process, thereby improving the overall performance and durability of the display device.
Implementation Method 1
an adhesive member with recess patterns on its surface is used to connect electronic components to display panels, featuring a combination of thermal initiators and non-conductive characteristics, which migrates during ultrasonic bonding to ensure reliable contact
Implementation Method 2
featuring a combination of thermal initiators and non-conductive characteristics, which migrates during ultrasonic bonding
Data Source
AI summary
An adhesive member is between an electronic component and an electronic panel that are connected to each other through the adhesive member. The adhesive member has a second surface and a first surface. The adhesive member includes a first recess pattern recessed from the first surface and a second recess pattern recessed from the first surface. The second recess pattern is spaced apart in a first direction from the first recess pattern. A sum of a planar area of the first recess pattern and a planar area of the second recess pattern ranges from about 20 percent (%) to about 70% of a planar area of the first surface.