Adhesive Base Release by Electromagnetic Dissolution for Chip Transfer
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Solution Overview
Problem
Conventional methods for releasing electronic components from adhesive base structures, such as dicing tapes, often result in damage due to die knocking and require significant effort, limiting efficiency and active area utilization.
Innovation Solution
The method involves using electromagnetic radiation to dissolve the adhesive base structure, allowing electronic components to be released and transferred to a carrier without mechanical needles, enabling precise and efficient handling and assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If conventional mechanical methods (e.g., needle-based release) are used to separate electronic components from adhesive base structures, then the release process can be performed, but damage occurs due to die knocking and significant effort is required
Solution Approach 1:
The patent replaces mechanical release methods (needles, physical separation tools) with electromagnetic radiation (laser) to dissolve the adhesive base structure. This substitution eliminates mechanical contact that causes die knocking, thereby reducing component damage risk while simplifying the release operation
Solution Approach 2:
The patent changes the physical-chemical state of the adhesive base structure by using electromagnetic radiation to alter its molecular bonds, transforming it from a solid adhesive state to a dissolved state. This parameter change enables release without mechanical force, resolving the contradiction between ease of operation and reliability
2Productivity
If conventional mechanical release methods are used, then components can be separated, but efficiency is limited due to significant effort and time required
Solution Approach 1:
By replacing mechanical separation processes with electromagnetic radiation-based dissolution, the patent achieves faster and more efficient release. The laser method eliminates the need for time-consuming mechanical operations, thereby improving productivity and reducing time loss
Solution Approach 2:
The adhesive base structure is designed to be pre-configured for laser dissolution, meaning its chemical composition is selected beforehand to be responsive to electromagnetic radiation. This preliminary preparation enables rapid release when irradiated, improving overall process efficiency
3Area of moving object
If mechanical release methods are used, then components can be freed from the base structure, but extensive safety edges are required to prevent damage
Solution Approach 1:
By eliminating mechanical contact during release, the patent removes the need for protective safety edges around active areas. The laser dissolution method acts on the adhesive material without touching the electronic component itself, allowing maximum utilization of the component's active area while maintaining protection
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the risk of damage and increases efficiency by allowing electronic components to be released and assembled without die knocking, enabling precise alignment and handling, and reducing the need for extensive safety edges.
Implementation Method 1
dissolving at least part of the base structure by irradiating the base structure with electromagnetic radiation to thereby release the electronic component
Implementation Method 2
an alignment unit for aligning a mutual position between, on the one hand, a carrier for carrying the electronic component and, on the other hand, the released electronic component (for instance falling downwardly by gravity)
Data Source
AI summary
A method is disclosed. In one example, the method comprises mounting an electronic component on an adhesive base structure on a temporary carrier, and dissolving at least part of the base structure by irradiating the base structure with electromagnetic radiation to thereby release the electronic component.