Adhesive Sheet Release Force Control via Stimulus-Responsive Particles
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Solution Overview
Problem
Adhesive sheets used in precision electronic device production cause warping of wafers due to high release force of release sheets, leading to 'tunneling' issues during storage, as existing solutions fail to balance release force and prevent wafer distortion effectively.
Innovation Solution
An adhesive sheet with a release sheet containing a release agent layer and expandable fine particles or gas generating particles, which decreases release force upon external stimulus, allowing for controlled peeling and reduced stress on wafers, thereby minimizing warping and 'tunneling' during storage and bonding processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a non-silicone release agent is utilized to prevent silicone contamination, then reliability is improved, but release force becomes unstable over time causing tunneling
Solution Approach 1:
The patent changes the chemical composition parameters of the release agent by incorporating specific functional materials (1,4-polybutadiene with 1,2-bond content of 5-50 mol%, expandable fine particles, and/or gas generating fine particles) to achieve both stable low release force and prevention of tunneling effect
Solution Approach 2:
The patent creates a composite release agent system combining 1,4-polybutadiene with expandable fine particles and/or gas generating fine particles, where the composite structure provides both stable release characteristics and resistance to tunneling effect
2Reliability
If release force is made high to prevent tunneling during storage, then reliability is improved, but wafer warping increases during bonding
Solution Approach 1:
The patent introduces dynamic response to external stimuli through expandable fine particles and gas generating fine particles that change the release force characteristics based on environmental conditions, allowing the release agent to adapt between storage and bonding phases
Solution Approach 2:
The patent utilizes parameter changes in the release agent's physical and chemical properties through the inclusion of stimulus-responsive materials that modify release force under different temperature and humidity conditions
3Manufacturing precision
If release force is reduced to minimize wafer warping, then manufacturing precision is improved, but tunneling occurs during storage
Solution Approach 1:
The patent applies preliminary action by incorporating expandable fine particles and gas generating fine particles that proactively respond to storage conditions to maintain adequate release force and prevent tunneling before it occurs
Solution Approach 2:
The patent enables self-service through stimulus-responsive materials that automatically adjust release force based on environmental conditions without external intervention, maintaining stability during storage and enabling release during bonding
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces wafer warping and prevents 'tunneling' by decreasing the release force between the release sheet and adhesive layer, ensuring stable bonding and storage conditions without silicone contamination, while maintaining a high release force to prevent premature release.
Implementation Method 1
the release agent layer decreases a release force between the release sheet and the adhesive layer in response to an external stimulus
Implementation Method 2
the releasing sheet having a releasing agent layer containing a gas generating agent in response to a stimulus
Data Source
AI summary
There is provided an adhesive sheet comprising an adhesive base sheet, an adhesive layer, and a release sheet laminated in sequence from the adhesive base sheet. The release sheet comprises a release agent layer and a release base material laminated in sequence from the adhesive layer. A release force between the release sheet and the adhesive layer is decreased by an external stimulus.


