Solvent-Based Adhesive Resin Composition for Bonding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing adhesive resin compositions lack excellent adhesiveness and durability when bonding various adherends such as metal, glass, and plastics, particularly when using solvent-based systems.
Innovation Solution
A solvent-based adhesive resin composition comprising acid-modified polyolefin resin, epoxy resin with a novolac structure, and an organic solvent, which forms a crosslinked structure for enhanced adhesiveness and durability, including specific ratios and components like maleic anhydride-modified polypropylene and phenol novolac-type epoxy resin.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If an acid-modified polyolefin resin is used as a sole essential component in an adhesive resin composition, then adhesiveness to organic or inorganic materials such as resin or metal can be improved, but durability becomes inferior
Solution Approach 1:
The patent combines acid-modified polyolefin resin with epoxy resin to create a composite adhesive system. The acid-modified polyolefin resin (containing carboxyl groups from grafting with maleic anhydride or other unsaturated carboxylic acids) provides initial adhesion to metal and organic substrates, while the epoxy resin forms a crosslinked network structure that enhances durability, chemical resistance, and thermal stability. This composite approach allows both materials to contribute their respective strengths without compromising either adhesiveness or durability.
2Stability of the object's composition
If extrusion molding is used to form an adhesive layer, then a stable film can be formed, but the amount of resin to be discharged is limited which restricts thinning of the laminate
Solution Approach 1:
The patent changes the physical state parameter of the adhesive composition from a solid resin requiring extrusion molding to a solvent-based liquid composition that can be applied by coating methods. By dissolving the acid-modified polyolefin resin and epoxy resin in an organic solvent, the composition becomes a fluid that can be applied as a thin layer through spraying, dipping, or rolling, thereby achieving much thinner adhesive layers (can be controlled to less than 10 micrometers) while maintaining film stability through the solvent system and subsequent drying/curing process.
3Length of stationary object
If a solvent-based adhesive resin composition is used to form a thin adhesive layer by application, then adhesive layer thickness can be reduced, but excellent adhesiveness to various adherends and durability has not been achieved
Solution Approach 1:
The solvent-based composition combines acid-modified polyolefin resin (providing adhesion through carboxyl groups) with epoxy resin (providing crosslinked durability). The organic solvent enables thin film application by coating methods, and upon evaporation, leaves behind a composite adhesive layer that maintains both excellent adhesion to diverse substrates (metal, glass, plastics) and long-term durability through the crosslinked epoxy network.
Solution Approach 2:
The use of organic solvent allows the adhesive to be applied in a dissolved state at room temperature or mild heating, forming a thin uniform coating. The solvent evaporation and subsequent curing (thermal or chemical) transform the liquid application into a solid, durable adhesive layer, achieving thin thickness without sacrificing performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves excellent adhesiveness and durability across various adherends, allowing for thin adhesive layers and improved bonding strength, with storage modulus values maintaining high temperature resistance.
Implementation Method 1
which forms a crosslinked structure for enhanced adhesiveness and durability
Implementation Method 2
a solvent-based adhesive resin composition comprising acid-modified polyolefin resin, epoxy resin with a novolac structure, and an organic solvent
Data Source
AI summary
The present invention provides an adhesive resin composition that has excellent adhesiveness and durability, a method for bonding adherends, and an adhesive resin film. More specifically, the present invention relates to an adhesive resin composition containing more than 50 parts by mass and 99.5 parts by mass or less in a solid content of an acid-modified polyolefin resin having a melting point of 50 to 100° C., 0.5 parts by mass or more and less than 50 parts by mass in a solid content of an epoxy resin having a novolac structure, and an organic solvent; a method for bonding adherends including forming an adhesive layer on a first adherend by applying the adhesive resin composition and drying, and then bonding a second adherend to the adhesive layer by laminating the second adherend on the adhesive layer; and an adhesive resin film including a first adhesive layer, a substrate layer, and a second adhesive layer in that order, in which any one or both of the first adhesive layer and the second adhesive layer include(s) the adhesive resin composition.