Adhesive and Resin Layer Peeling for Flexible Semiconductor Fabrication

An adhesive layer is introduced as an intermediary between the glass substrate and the heat-resistant resin layer. This adhesive layer has controlled adhesion strength that allows the resin layer to be easily peeled off after serving its protective function during device fabrication, resolving the contradiction between maintaining flexibility/thinness and enabling easy peeling.

The adhesion strength of the adhesive layer is optimized to provide sufficient bonding during fabrication but allow easy peeling afterward. By controlling the adhesion parameters of the intermediate layer, the system transitions from a permanently bonded state to a separable state, enabling both flexibility and ease of manufacture.

The conventional mechanical peeling method is replaced with light irradiation (laser processing) to separate the material layers. This optical method reduces mechanical stress and damage to the substrate and deposited layers, significantly improving yield despite the added process complexity.

Light irradiation induces localized heating and phase transitions at the interface between layers, enabling clean separation without mechanical contact. This thermal-optical approach minimizes damage while achieving effective layer separation, improving productivity.

The adhesive layer serves as a thermal buffer and intermediary that allows effective peeling at lower temperatures. It absorbs and distributes thermal energy, enabling successful separation without subjecting the substrate and deposited layers to damaging high temperatures, thus maintaining reliability.

Light irradiation is applied locally at the interface between layers rather than heating the entire substrate uniformly. This localized heating approach achieves effective peeling at the specific separation point while keeping the rest of the substrate and layers at safe temperatures, preserving substrate integrity.

The adhesive layer is designed as a composite material with specific combinations of polymers and additives that provide both adequate adhesion during fabrication and controlled peeling afterward. This composite structure achieves reliable adhesion control while maintaining relatively simple fabrication processes.

The single resin layer is segmented into multiple functional sub-layers with different properties: one portion provides strong adhesion to the substrate during fabrication, while another portion allows easy peeling after device completion. This segmentation enables both fabrication simplicity and reliable adhesion control.