Adhesive Resin Composition for Semiconductor Dicing
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Solution Overview
Problem
The challenge is to develop an adhesive resin composition and film for semiconductors that provides excellent impact resistance, mechanical properties, and heat resistance while maintaining high adhesive strength, especially for thin semiconductor devices to prevent damage during the wire bonding process and ensure reliable chip integration.
Innovation Solution
The adhesive resin composition includes a (meth)acrylate-based resin with epoxy-based functional groups, an epoxy resin with a softening point above 70°C, and a phenol resin with a softening point above 105°C, formulated within specific weight ratios to create a cross-linking structure that enhances mechanical and thermal properties, and is applied in a dicing die bonding film for semiconductor wafers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the adhesive film is thinned to 20 μm or less to enable miniaturization and high integration of semiconductor packages, then the density and integration of the package are improved, but the impact resistance of the adhesive film deteriorates, making semiconductor chips more susceptible to cracking and damage during wire bonding
Solution Approach 1:
The patent employs a composite adhesive film structure consisting of a polymer base material combined with a specific resin composition containing epoxy resin, phenolic resin, and (meth)acrylate-based resin. This composite formulation provides both the thinness required for high integration and the impact resistance needed to protect chips during wire bonding through synergistic material properties
Solution Approach 2:
The patent optimizes the molecular weight, functional group content, and weight ratios of resin components to achieve the desired balance between film thickness and impact resistance. By controlling parameters such as the weight ratio of (meth)acrylate-based repeating units (10-40 wt%) and the specific molecular weight range of the polymer, the adhesive film maintains both thinness and mechanical strength
2Ease of manufacture
If conventional adhesive formulations are used in thinned adhesive films, then manufacturing simplicity is maintained, but adhesive strength and mechanical properties deteriorate, failing to provide sufficient protection for thin semiconductor chips
Solution Approach 1:
The patent specifies precise parameter ranges for resin components including molecular weight (10,000-1,000,000), functional group content (10-40 wt% (meth)acrylate-based repeating units), and weight ratios to achieve optimal adhesive strength while maintaining ease of manufacture through a standardized formulation approach
Solution Approach 2:
The adhesive film uses a composite resin system combining epoxy resin, phenolic resin, and (meth)acrylate-based resin in specific proportions, creating a material that delivers superior adhesive strength and mechanical properties while remaining compatible with existing manufacturing processes
3Object-affected harmful factors
If the adhesive film lacks sufficient impact resistance, then chip protection during wire bonding is inadequate, but increasing adhesive film thickness compromises miniaturization and high integration goals
Solution Approach 1:
The patent develops a composite adhesive film with enhanced toughness through the combination of polymer base material and optimized resin composition, achieving high impact resistance in a thin film configuration that does not compromise miniaturization goals
Solution Approach 2:
By adjusting parameters such as the glass transition temperature, molecular weight, and functional group content of the resin components, the patent achieves optimal balance between film thickness and impact protection capability, enabling thin films to provide sufficient chip protection during wire bonding
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution achieves high impact resistance, mechanical strength, and thermal stability, minimizing chip damage and burr formation during dicing, thereby improving the reliability and longevity of semiconductor chips and packages.
Implementation Method 1
a cross-linking structure that enhances mechanical and thermal properties
Implementation Method 2
excellent impact resistance as well as a high mechanical property and heat resistance
Implementation Method 3
high mechanical property and heat resistance
Data Source
AI summary
The present invention relates to an adhesive resin composition for bonding semiconductors, including: a (meth)acrylate-based resin including more than 17% by weight of (meth)acrylate-based repeating units containing epoxy-based functional groups; an epoxy resin having a softening point of more than 70° C.; and a phenol resin having a softening point of more than 105° C., wherein the weight ratio of the (meth)acrylate-based resin is 0.48 to 0.65 relative to the total weight of the (meth)acrylate-based resin, the epoxy resin, and the phenol resin, an adhesive film for semiconductors obtained from the resin composition, a dicing die-bonding film including an adhesive layer that includes the adhesive film for semiconductors, a semiconductor wafer including the dicing die-bonding film, and a dicing method for the semiconductor wafer using the dicing die-bonding film.