Double-Layered Adhesive Resin for Semiconductor Substrate Separation
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Solution Overview
Problem
Current semiconductor packaging technologies face challenges in achieving high thermal process resistance, easy separation of support, and increased productivity due to limitations in adhesive systems and materials used for three-dimensional semiconductor packages, particularly in FOWLP and TSV-forming processes.
Innovation Solution
A semiconductor device with a double-layered adhesive resin system, comprising a light-decomposable resin layer and a non-silicone-based thermoplastic resin layer with a glass transition temperature of 200°C or higher, which allows for tight bonding and easy separation, enabling improved thermal resistance and productivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a single-layer adhesive resin system is used, then the structure is simple, but thermal process resistance is insufficient and separation control is difficult
Solution Approach 1:
The adhesive resin system is divided into two functional layers: a first adhesive resin layer containing a thermoplastic resin with Tg of 80°C or higher for thermal process resistance, and a second adhesive resin layer containing a laser-decomposable resin for easy separation. This segmentation allows each layer to perform its specific function independently, resolving the contradiction between thermal resistance and separation ease.
Solution Approach 2:
The patent uses a composite adhesive system combining two different resin materials with complementary properties. The thermoplastic resin provides heat resistance and bonding strength, while the laser-decomposable resin enables controlled separation. This composite approach achieves both thermal process resistance and easy separation without requiring a single complex material.
2Ease of operation
If a thermoplastic resin with low glass transition temperature is used, then ease of bonding is improved, but thermal process resistance deteriorates
Solution Approach 1:
The adhesive system is segmented into two layers with different thermal characteristics. The first layer uses a thermoplastic resin with Tg ≥ 80°C to withstand thermal processes, while the second layer uses a laser-decomposable resin that remains soft at low temperatures for easy bonding operations. This segmentation resolves the contradiction between bonding ease and thermal resistance.
3Ease of manufacture
If a laser-decomposable resin release layer is used, then easy separation is achieved, but the release layer deforms under high-temperature curing conditions
Solution Approach 1:
The adhesive system is divided into two layers: the first layer (thermoplastic resin with high Tg) provides thermal stability during curing, while the second layer (laser-decomposable resin) provides easy separation functionality. The first layer acts as a thermal barrier protecting the second layer from deformation during high-temperature curing, resolving the contradiction between separation ease and curing stability.
Solution Approach 2:
The first adhesive resin layer with high thermal resistance is placed beneath the laser-decomposable resin layer to provide thermal protection in advance. This cushioning layer prevents the laser-decomposable resin from deforming during subsequent high-temperature curing processes, while still allowing easy separation when needed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The semiconductor device achieves enhanced thermal resistance and easy separation of the semiconductor substrate from the support, ensuring tight bonding of layers and improved productivity in semiconductor package production.
Implementation Method 1
a resin layer A containing a resin decomposable by light irradiation
Implementation Method 2
a resin layer B containing a non-silicone-based thermoplastic resin, the resin layer B having a glass transition temperature of 200° C. or higher
Data Source
AI summary
Disclosed herein is a semiconductor device including: a support; a double-layered adhesive resin layer formed on the support, an insulating layer and a redistribution layer formed on the adhesive resin layer; a chip layer, and a mold resin layer, wherein the adhesive resin layer includes a resin layer A containing a resin decomposable by light irradiation and a resin layer B containing a non-silicone-based thermoplastic resin, the resin layer A and the resin layer B being provided in this order from the support side, the resin decomposable by light irradiation is a resin containing a fused ring in its main chain, and the non-silicone-based thermoplastic resin has a glass transition temperature of 200° C. or higher.