Adhesive-Sealed Electronic Package Against Moisture and Oxygen

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Solution Overview

Problem

Electronic devices, particularly those used in outdoor environments, face challenges in maintaining environmental reliability due to exposure to moisture and oxygen, which can lead to damage and degradation of components.

Innovation Solution

The electronic device is designed with a substrate, a first metal layer, an electronic component, a cover layer, and an adhesive layer, where the adhesive layer encloses the component to protect it from moisture and oxygen, and may include additional encapsulation layers or fillers to enhance protection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If electronic devices are used in outdoor environments, then they can be applied in various fields, but they are exposed to moisture and oxygen which lead to damage and degradation of components

Engineering Contradiction:

Improveapplication in various fieldsVSAvoidenvironmental reliability

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The patent creates an inert protective environment by filling the sealed cavity with nitrogen gas, which displaces moisture and oxygen from the interior space. This inert atmosphere prevents oxidation and degradation of electronic components while maintaining the device's adaptability for outdoor use in various fields.

Inventive Principle:

Principle #39Inert atmosphere (Inert environment)

Solution Approach 2:

The patent employs a cost-effective sealing approach using adhesive layers and seal structures that create a disposable or replaceable protective enclosure. This allows the protective packaging to be manufactured economically while providing sufficient protection against environmental factors during the device's operational lifecycle.

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

2Reliability

If adhesive layer and seal structures are added to protect components, then environmental reliability is improved, but device complexity increases

Engineering Contradiction:

Improveenvironmental reliabilityVSAvoidstructure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent utilizes thin adhesive layers and flexible seal structures to create an effective protective barrier. These thin-film solutions provide reliable sealing against moisture and oxygen infiltration while adding minimal structural complexity and maintaining a compact device design.

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The protective structure is divided into distinct functional segments: adhesive layers for bonding, seal structures for closure, and nitrogen filling for atmospheric protection. This segmentation allows each component to perform its specific function efficiently while simplifying the overall manufacturing and assembly process.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration improves the reliability of the electronic device by reducing exposure to moisture and oxygen, thereby enhancing the durability and performance of the components.

Implementation Method 1

The adhesive layer is adhered to the substrate and the cover layer

Methodology Applied

Scientific EffectAdhesion: Adhesive

Data Source

PatentUS12593725B2Electronic device

Publication Date: 2026.03.31 INNOLUX CORP

AI summary

Provided is an electronic device including a substrate, a first metal layer, an electronic component, a cover layer, and an adhesive layer. The first metal layer is formed on the substrate. The electronic component is disposed on the substrate and electrically connected to the first metal layer. The adhesive layer is adhered to the substrate and the cover layer.