Adhesive Sheet for Semiconductor Fixation
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Solution Overview
Problem
Existing adhesive sheets for temporary fixation of semiconductor chips face challenges in maintaining high adhesive force and heat resistance during manufacturing processes, while also ensuring sufficient peelability without leaving residues or damaging the chip.
Innovation Solution
An adhesive sheet comprising a polymer base film with a glass transition temperature of 60° C. or more, combined with an adhesive layer containing a binder resin with photoreactive functional groups, a photoinitiator active at 300 nm or more, and a tertiary amine compound, which maintains a high adhesive force during heat treatment and reduces adhesive force upon UV irradiation for easy peeling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If an ultraviolet curable adhesive is used to reduce adhesive force by ultraviolet irradiation, then peelability is improved, but additives such as photoinitiators are thermally decomposed during high temperature process
Solution Approach 1:
The patent changes the key parameter of photoinitiator activity wavelength from conventional UV range (below 300 nm) to near-UV/visible range (300 nm or more). This parameter change allows the photoinitiator to remain stable during high-temperature semiconductor manufacturing processes while still enabling effective photocuring for adhesive force reduction during peeling operations.
Solution Approach 2:
The patent employs a photoinitiator system that is stable during the manufacturing process but becomes activated and effective only when exposed to light at 300 nm or more during the peeling stage. This creates a temporary, condition-activated functionality that is disposed of (adhesive force reduced) only when needed.
2Ease of operation
If existing photoinitiators are used in the adhesive, then adhesive force reduction is achieved, but adhesive force reduction is not sufficient during peeling due to migration of additives
Solution Approach 1:
The patent creates a composite adhesive system combining a photoreactive functional group-containing binder resin with a specific photoinitiator (active at 300 nm or more) and a tertiary amine compound. This composite formulation ensures sufficient adhesive force reduction during peeling without additive migration, achieving both ease of operation and manufacturing precision.
3Reliability
If high heat resistance is required to prevent deterioration of adhesive force during high temperature process, then adhesive stability is improved, but peelability may be compromised
Solution Approach 1:
The patent creates a dynamic adhesive system where the adhesive force can be changed on demand. During high-temperature manufacturing, the adhesive maintains high stability. When exposed to light at 300 nm or more during peeling, the adhesive force dynamically reduces, enabling easy removal without compromising either heat resistance or peelability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive sheet provides excellent heat resistance and adhesive force during semiconductor manufacturing, with a significant reduction in adhesive force upon photocuring, enhancing manufacturing efficiency and ensuring high-quality semiconductor devices without residues or damage.
Implementation Method 1
at least one adhesive layer including a binder resin having a photoreactive functional group, a photoinitiator having activity at a wavelength of 300 nm or more
Implementation Method 2
irradiating UV rays onto the base film of the adhesive sheet for temporary fixation after performing the predetermined process
Data Source
AI summary
An adhesive sheet for temporary fixation which may have excellent heat resistance to exhibit a sufficient adhesive force even though it undergoes a high temperature process during a process of manufacturing a semiconductor device and may also exhibit a sufficient reduction of the adhesive force by photocuring during the step of peeling off, and a method of manufacturing a semiconductor device using the same, are provided.