Adhesive Agent for Semiconductor Wafer Bonding
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Solution Overview
Problem
Existing adhesives fail to securely bond and temporarily secure semiconductor wafers in high-temperature environments without causing damage or failure upon removal, as they either flow or apply stress leading to warping and fracture.
Innovation Solution
A multivalent vinyl ether compound combined with a compound containing two or more hydroxy or carboxy groups, forming a thermoplastic polymer with a high softening point, which maintains adhesiveness at high temperatures and can be easily removed through heat or acid treatment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a waxy adhesive is used for wafer temporary securing, then the wafer can be easily removed after processing, but the adhesive flows at high temperatures and fails to secure the wafer during high-temperature processes
Solution Approach 1:
The patent modifies the chemical composition parameters of the adhesive by incorporating a multivalent vinyl ether compound and a compound with multiple hydroxy or carboxy groups, which fundamentally changes the temperature-dependent behavior of the adhesive to maintain stability at high temperatures while enabling easy removal through acid treatment
Solution Approach 2:
The patent creates a composite adhesive system combining multiple chemical components (multivalent vinyl ether compound, compound with hydroxy/carboxy groups, and optional acid generator) that work synergistically to achieve both high-temperature bonding reliability and easy removal properties
2Reliability
If a heat-sensitive adhesive including pressure-sensitive adhesive and side-chain crystalline polymer is used, then the adhesive can maintain bonding at high temperatures, but the adhesive flows and fails to secure the wafer in high-temperature processes
Solution Approach 1:
The patent changes the chemical structure parameters by using a multivalent vinyl ether compound cross-linked with compounds containing multiple hydroxy or carboxy groups, creating a network structure that maintains dimensional stability and prevents flowing at high temperatures
3Duration of action of stationary object
If an adhesive cured by ultraviolet irradiation is used, then the adherend can be removed after curing, but the adhesive applies stress to the wafer upon removal and causes warping and fracture
Solution Approach 1:
The patent replaces the UV curing mechanism with a thermal curing mechanism followed by acid treatment for removal, substituting the removal method from mechanical stress-based (UV breakdown) to a chemical dissolution-based approach that eliminates wafer damage
Solution Approach 2:
The patent introduces an acid generator as an intermediary component that, when activated, produces acid to dissolve the adhesive bonds, providing a gentle chemical mediation process that removes the adhesive without applying mechanical stress to the wafer
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive maintains strong bonding in high-temperature environments and allows for easy removal of semiconductor wafers without damage, with the ability to dissolve residual adhesive for clean-up.
Implementation Method 1
undergoes polymerization, via acetal bonding, between the multivalent vinyl ether compound and the compound containing two or more hydroxy groups or two or more carboxy groups
Implementation Method 2
undergoes polymerization, via acetal bonding, between the multivalent vinyl ether compound and the compound containing two or more hydroxy groups or two or more carboxy groups and gives a thermoplastic polymer
Implementation Method 3
The polymer, when heated at a temperature equal to or higher than the softening point or melting point, immediately softens or liquefies to lose part or all of the adhesiveness
Implementation Method 4
The polymer has acetal-bonding moieties (acetal bonds) which are easily decomposable by the action of an acid. The polymer, when subjected to an acid treatment before heating, immediately softens or liquefies to lose part or all of the adhesiveness
Data Source
AI summary
Provided are: an adhesive that offers high adhesiveness to bond and secure an adherend even in a high-temperature environment, as long as securing is necessary. The adherend can be removed without failure and without adhesive residue once securing becomes unnecessary; and a method for processing an adherend using the adhesive. The adhesive according to the present invention contains a multivalent vinyl ether compound (A) and at least one of a compound (B) and a compound (C). The compound (B) is represented by Formula (b). The compound (C) includes two or more constitutional units each represented by Formula (c). Formulae (b) and (c) are expressed as follows: