Adhesive Composition for Semiconductor Packaging
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Solution Overview
Problem
Existing adhesive compositions for semiconductor devices face challenges in uniformly mixing coupling agents, leading to unstable adhesiveness during wire bonding and reduced adhesive strength, especially in multistacked packages, where simultaneous curing methods can result in partially cured adhesive layers with compromised bonding properties.
Innovation Solution
An adhesive composition comprising an acrylic polymer, a heat-curable resin with unsaturated hydrocarbon groups, and a silane coupling agent, which allows for uniform mixing and stable wire bonding before curing, enhancing adhesive strength and reliability between semiconductor chips and circuit boards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a coupling agent is blended to the adhesive layer to improve adhesiveness between chips, then adhesive strength is improved, but uniform mixing of the coupling agent becomes difficult leading to unstable adhesiveness
Solution Approach 1:
The patent uses a composite adhesive system combining acrylic polymer and epoxy resin in specific ratios (acrylic polymer: 30-70 wt%, epoxy resin: 70-30 wt%). This composite structure allows the coupling agent to be uniformly distributed throughout the adhesive layer while maintaining stable adhesiveness, resolving the contradiction between improving adhesive strength and achieving uniform mixing.
Solution Approach 2:
The patent optimizes the ratio parameters of the adhesive components (acrylic polymer and epoxy resin) to ensure proper dispersion of the coupling agent. By controlling the compositional parameters within specific ranges, the system achieves both uniform mixing and stable adhesive performance.
2Productivity
If simultaneous curing of adhesive layer is applied to improve productivity, then production efficiency is improved, but adhesive layer becomes partially cured during wire bonding causing chip vibration and displacement
Solution Approach 1:
The patent applies preliminary curing to the adhesive layer before wire bonding, creating a semi-cured state that provides sufficient stability during subsequent wire bonding operations. This preliminary action prevents chip vibration and displacement while still allowing the adhesive to achieve full curing later, thus maintaining both productivity and reliability.
Solution Approach 2:
The patent introduces a preliminary curing step as a cushioning measure before wire bonding, ensuring that the adhesive layer has adequate strength to prevent chip displacement during the wire bonding process, while the final curing is completed after wire bonding to maintain productivity.
3Reliability
If unsaturated hydrocarbon group containing epoxy resin is used to improve compatibility with acrylic polymer, then adhesive reliability is improved, but uniform mixing with coupling agent becomes more difficult
Solution Approach 1:
The patent controls the ratio parameters of acrylic polymer and unsaturated hydrocarbon group containing epoxy resin within specific ranges (acrylic polymer: 30-70 wt%, epoxy resin: 70-30 wt%). By optimizing these compositional parameters, the system achieves both improved adhesive reliability and uniform mixing with the coupling agent.
Solution Approach 2:
The patent creates a composite adhesive system where acrylic polymer and unsaturated hydrocarbon group containing epoxy resin are combined in controlled proportions. This composite structure improves compatibility and adhesive reliability while maintaining uniform distribution of the coupling agent throughout the adhesive layer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive composition ensures stable wire bonding and excellent adhesive strength between chips and circuit boards, even under harsh conditions, improving the reliability and productivity of semiconductor device packaging.
Implementation Method 1
a silane coupling agent, which allows for uniform mixing and stable wire bonding before curing, enhancing adhesive strength and reliability
Implementation Method 2
a heat curable resin (B) having unsaturated hydrocarbon group
Data Source
AI summary
An adhesive composition includes an acrylic polymer (A), a heat curable resin (B) having unsaturated hydrocarbon group, and a coupling agent (C) having reactive a double bond group.