Adhesive Sensor Tape With External Probe for Harsh Environments

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Solution Overview

Problem

Existing asset tracking and management systems face challenges in providing continuous monitoring and seamless integration of wireless communication and sensing capabilities across heterogeneous environments, often requiring additional materials and labor, and lacking cost-effective infrastructure for efficient deployment.

Innovation Solution

A flexible adhesive tape platform integrating wireless communication and sensing components within a flexible adhesive structure, allowing seamless deployment for asset tracking and management, with embedded energy sources, processors, and transducers, and a form factor that maintains flexibility and protection from damage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If wireless sensor and communication devices are deployed in heterogeneous environments, then continuous monitoring capability is improved, but device complexity and deployment cost increase

Engineering Contradiction:
Improvecontinuous monitoring capabilityVSAvoiddevice complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines wireless communication transceivers, sensor arrays, processors, and power management circuits into a single integrated adhesive tape platform. This merging of multiple functional components into one device reduces the number of separate devices needed for deployment, thereby maintaining continuous monitoring capability while reducing overall system complexity and deployment cost.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The adhesive tape platform is designed as a universal device that can perform multiple functions including wireless communication, environmental sensing, asset tracking, and data processing. This multi-functionality allows a single device type to operate across heterogeneous environments, improving monitoring reliability without requiring multiple specialized devices that would increase complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Reliability

If additional materials and labor are used for deployment, then sensing and communication capabilities are enhanced, but deployment cost increases

Engineering Contradiction:
Improvesensing and communication capabilitiesVSAvoiddeployment materials and labor
Core Design Contradiction:
ReliabilityVSQuantity of substance

Solution Approach 1:

By integrating sensors, transceivers, processors, and power sources into a single adhesive tape platform, the patent eliminates the need for separate deployment of multiple components. This consolidation reduces the quantity of materials required and simplifies installation procedures, thereby enhancing sensing and communication capabilities without proportionally increasing deployment resources.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The use of a flexible adhesive tape form factor allows the device to be easily applied to various surfaces without requiring complex mounting structures or additional fastening materials. The thin film nature of the adhesive platform enables simple deployment processes that reduce labor requirements while maintaining full sensing and communication functionality.

Inventive Principle:
Principle #30Flexible shells and thin films

Data Source

PatentUS12541668B2Adhesive tape platform with form factor for improved sensing and external sensor probe
Publication Date: 2026.02.03 TRACKONOMY SYSTEMS INC
  • US12541668B2 patent drawing
  • US12541668B2 patent drawing
  • US12541668B2 patent drawing

AI summary

A wireless sensor device includes a flexible substrate, a cover layer on the flexible substrate, a device layer between the flexible substrate and the cover layer, and a printed circuit board connecting components of the device layer including an electrostatic discharge protected port for connecting an external sensor probe to the wireless sensor device. The device layer includes a processor, a memory, a battery, a first wireless communication system, and one or more onboard sensors; and a printed circuit board connecting components of the device layer comprising an electrostatic discharge protected port for connecting an external sensor probe to the wireless sensor device. The external probe allows for the wireless sensor device to perform sensor readings in environments that are too extreme or hostile to the wireless sensor device, while the wireless sensor device is safely isolated from the extreme or hostile environment.