Adhesive Shaping Ribbon Connection for Intravascular Guide Wires
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Solution Overview
Problem
Existing intravascular guide wires face challenges in reliably connecting the shaping ribbon to the core member, particularly due to the use of corrosive flux in soldering processes, which complicates manufacturing and increases the risk of device failure.
Innovation Solution
The use of an adhesive within connecting sleeves positioned around the core member and shaping ribbon provides a reliable and consistent connection, eliminating the need for corrosive flux and soldering, thereby reducing the risk of device failure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If soldering with corrosive flux is used to connect shaping ribbon to core member, then connection strength is improved, but manufacturing complexity and risk of device failure increase due to flux cleaning requirements
Solution Approach 1:
The patent replaces the soldering process (thermal/chemical system) with an adhesive bonding process (mechanical/chemical system). The adhesive is applied to the core member and cures to form a strong bond with the shaping ribbon, eliminating the need for corrosive flux and high-temperature soldering while maintaining connection strength.
Solution Approach 2:
The adhesive acts as an intermediary substance between the core member and shaping ribbon. Instead of directly soldering the two components together (which requires flux), the adhesive mediates the bonding process, providing a reliable connection without the harmful effects of corrosive flux.
2Ease of manufacture
If soldering process is used to attach shaping ribbon, then connection is achieved, but reliability decreases due to risk of corrosion from residual flux
Solution Approach 1:
The patent eliminates the harmful aspect (corrosive flux) entirely by using adhesive bonding instead of soldering. This converts the potentially harmful chemical process into a benign bonding process that maintains reliability while achieving the connection function.
Solution Approach 2:
The adhesive bonding process replaces the soldering process, eliminating the source of corrosion (flux) while maintaining the connection function. This substitution improves reliability by removing the corrosion risk entirely.
3Ease of manufacture
If tack solder is used to connect shaping ribbon to core member, then connection is formed, but manufacturing precision decreases due to difficulty in controlling solder joint length
Solution Approach 1:
The adhesive bonding process replaces soldering, allowing for more precise control of the bond line thickness and length. The adhesive can be applied in controlled amounts and cured uniformly, providing consistent joint dimensions that are difficult to achieve with manual soldering.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances the reliability and consistency of the connection between the core member and shaping ribbon, improving the manufacturing process and reducing the risk of device failure, thus ensuring safer and more effective intravascular procedures.
Implementation Method 1
a shaping ribbon coupled to the core member with an adhesive. In some instances, the adhesive is introduced within one or more connecting sleeves positioned around the core member and the shaping ribbon
Data Source
AI summary
The present disclosure is directed to intravascular devices, systems, and methods having a core member coupled to a shaping ribbon with an adhesive. In some aspects, a sensing guide wire is provided. The sensing guide wire can include a flexible elongate member; and a sensing element coupled to a distal portion of the flexible elongate member, wherein the distal portion of the flexible elongate member includes: a core member; and a shaping ribbon fixedly secured to the core member by an adhesive and at least one connecting sleeve. In other aspects, methods of forming a sensing guide wire are provided.


