Thermosetting Adhesive Sheet Suppressing Epoxy Exudation

The patent applies preliminary action by partially cross-linking the acrylic copolymer before the final curing step. This pre-cross-linking creates a network structure that binds epoxy resin, preventing exudation during thermal compression molding while still allowing the adhesive to achieve full bonding strength after complete curing

The patent uses composite materials by combining acrylic copolymer with epoxy groups, epoxy resin, and curing agent in a specific formulation. The acrylic copolymer acts as a matrix that holds the epoxy resin, creating a composite system where the cross-linked acrylic network prevents exudation while the epoxy provides bonding strength

The patent extracts the UV curing step and special storage requirements from the adhesive system. Instead of using UV curable resin, the invention employs a thermosetting system with partial pre-cross-linking that prevents exudation through chemical cross-linking structure alone, eliminating the need for additional UV equipment and special storage conditions

The patent replaces complex UV curing infrastructure with a simple thermal curing process. The partial pre-cross-linking is achieved through conventional mixing and storage, and final curing is done through standard thermal compression molding, eliminating the need for expensive UV application equipment and special storage facilities