Adhesive Sheet with Non-Ionic Anti-Static Compound for Semiconductor Wafer Processing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional adhesive sheets for semiconductor wafer processing suffer from poor anti-static performance, potential circuit corrosion due to ionic agents, and loss of anti-static effect after UV curing, leading to static electricity-related damages and contamination issues.
Innovation Solution
An adhesive sheet with a substrate and adhesive layers containing a specific compound, such as polyalkyleneglycol diglycidylether(meth)acrylate, which provides excellent anti-static properties and maintains effectiveness even after energy ray irradiation, preventing corrosion and static electricity generation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an ionic anti-static agent is used in the adhesive layer, then anti-static performance is improved, but circuit corrosion is caused by ions
Solution Approach 1:
The patent changes the chemical composition parameters of the anti-static agent by using non-ionic compounds (specifically compounds with quaternary ammonium/organic acid salt groups as side chains) instead of traditional ionic anti-static agents. This parameter change maintains the anti-static function while eliminating the corrosive ion release that damages circuits.
Solution Approach 2:
The patent creates a composite adhesive material that combines the adhesive base polymer with non-ionic anti-static compounds having specific molecular structures (quaternary ammonium/organic acid salt side chains). This composite approach integrates multiple functions (adhesion and anti-static protection) while avoiding the harmful ionic characteristics of conventional materials.
2Speed
If UV curable adhesive is used, then curing speed is improved, but anti-static effect is lost after curing
Solution Approach 1:
The patent modifies the molecular structure parameters of the anti-static compound by incorporating UV-curable functional groups (such as acrylate groups) into the non-ionic anti-static molecule. This allows the compound to maintain its anti-static properties while becoming UV-curable, thus resolving the contradiction between curing speed and anti-static effect retention.
Solution Approach 2:
The patent develops a multi-functional adhesive compound that simultaneously provides: (1) anti-static protection through its quaternary ammonium/organic acid salt structure, (2) UV curability through incorporated polymerizable groups, and (3) adhesive properties. This multi-functionality eliminates the need to choose between curing speed and anti-static effect retention.
3Strength
If adhesive layer is made insulating, then adhesion is improved, but anti-static performance deteriorates
Solution Approach 1:
The patent changes the electrical conductivity parameter of the adhesive layer by incorporating non-ionic anti-static compounds with specific molecular structures. These compounds provide sufficient surface conductivity for anti-static performance while maintaining the bulk insulating properties needed for good adhesion, thus resolving the contradiction between adhesion strength and anti-static performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive sheet exhibits superior anti-static performance and maintains holding power, preventing circuit damage and contamination, with improved removability and productivity in semiconductor processing.
Implementation Method 1
at least one of the adhesive layers contains an adhesive and a compound (1) represented by the following general formula (1)... which provides excellent anti-static properties
Implementation Method 2
an adhesive sheet composed of a substrate and an adhesive layer laminated on one or both surfaces of the substrate
Data Source
AI summary
An adhesive sheet having a substrate and an adhesive layer laminated on one or both surfaces of the substrate, and which has an anti-static performance, is described. At least one of the adhesive layers contains an adhesive and a compound (1) represented by the following formula (1), and contains the compound (1) in an amount of from 0.1 to 100 parts by mass on the basis of 100 parts by mass of the adhesive.In the formula, R1 is a (meth)acryloyl group; R2 is a C1-4 alkylene group; and n is an integer of from 1 to 20, such as 4 to 16.