Adhesive Sheet with Crystalline Silica for Semiconductor Alignment and Heat Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor technologies face challenges in accurately aligning multiple semiconductor devices and effectively dissipating heat generated during operation, which affects the reliability and performance of electronic products.
Innovation Solution
A semiconductor package is designed with an adhesive sheet that includes a polymer matrix and crystalline silica fillers, providing high thermal conductivity and visibility, allowing for accurate alignment and efficient heat dissipation. The adhesive sheet contains a polymer matrix with epoxy-based, acryl-based, or bismaleimide-based polymers and crystalline silica fillers, which are dispersed to achieve optimal thermal conductivity and sphericity, ensuring effective heat dissipation and alignment of semiconductor devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional adhesive materials are used for stacking semiconductor devices, then the devices can be bonded together, but the alignment precision deteriorates and heat dissipation performance is insufficient
Solution Approach 1:
The adhesive sheet is constructed as a composite material consisting of a polymer matrix (epoxy, acryl, bismaleimide, or phenoxy-based) combined with crystalline spherical silica fillers. This composite structure provides both precise alignment capability through the polymer matrix and superior heat dissipation through the high thermal conductivity silica particles, resolving the contradiction between alignment precision and heat dissipation performance
Solution Approach 2:
The patent optimizes specific parameters of the adhesive sheet including silica filler content (30-90 wt%), particle size (1-50 μm), and spherical shape (sphericity ≥0.8) to achieve both high alignment precision and effective heat dissipation. The controlled parameter changes enable the adhesive sheet to simultaneously satisfy optical transparency for alignment and thermal conductivity for heat management
2Temperature
If the adhesive sheet contains high silica filler content for heat dissipation, then thermal conductivity improves, but manufacturing complexity increases
Solution Approach 1:
The patent employs spherical silica particles with high sphericity (≥0.8) to simplify the manufacturing process. The spherical shape allows for easier dispersion in the polymer matrix, reduces aggregation issues, and simplifies molding operations compared to irregularly shaped fillers, thereby maintaining high thermal conductivity while reducing manufacturing complexity
Solution Approach 2:
The patent optimizes the silica filler content within a specific range (30-90 wt%) and controls particle size (1-50 μm) to achieve effective heat dissipation without excessive manufacturing complexity. This parameter optimization balances thermal performance with ease of processing and manufacturing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables accurate alignment and efficient heat dissipation in semiconductor packages, enhancing the reliability and performance of electronic products by utilizing the adhesive sheet's high thermal conductivity and visibility, thereby addressing the challenges of heat management and device alignment.
Implementation Method 1
the adhesive sheet includes a matrix and a crystalline silica fillers dispersed in the matrix... the crystalline silica filler has a thermal conductivity of about 5 W/(m·K) to about 30 W/(m·K)... good heat conductivity
Implementation Method 2
high transmittance in a visible light range... accurately aligns a plurality of semiconductor devices when stacking them
Data Source
AI summary
A semiconductor package includes: a first substrate; a second substrate including a semiconductor element formed thereon; a film layer between the first substrate and the second substrate; and a molding member surrounding the second substrate, wherein the film layer includes a crystalline spherical silica filler distributed in a matrix.