Adhesive Sheet Sticking Tension Control for Wafer Processing
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Solution Overview
Problem
Existing sheet sticking apparatuses fail to maintain constant tension during the sticking process, leading to wrinkles, air bubbles, and warp deformation, and result in wasteful consumption of sheets due to line-like dent formations on the adhesive layer.
Innovation Solution
A sheet sticking apparatus with a tension measuring means and a sticking angle maintaining mechanism that adjusts the sheet tension to a predetermined preset level before sticking, using a press roller and a feed-out head to maintain constant tension and angle, ensuring precise sticking without excess or shortage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If guide rollers nip the adhesive sheet constantly throughout sticking operation, then the adhesive sheet is fed stably, but a line-like dent portion is formed on the adhesive layer causing thickness unevenness or breakage in grinding process
Solution Approach 1:
The tension measuring means measures the sheet tension in advance before the sticking operation to determine the appropriate nipping force, preventing dent formation during the actual feeding process while maintaining stable sheet delivery
Solution Approach 2:
The nipping force of the guide rollers is adjusted based on the measured tension values, changing the mechanical parameters of the feeding system to eliminate dent formation while preserving feeding stability
2Device complexity
If sheet tension is not maintained constant during sticking operation, then the sticking process is simple, but wrinkles are generated and air bubbles are caught on the adhesive sheet
Solution Approach 1:
The tension measuring means provides real-time feedback on sheet tension during the sticking operation, enabling dynamic adjustment of feeding parameters to maintain constant tension and prevent wrinkles and air bubbles
Solution Approach 2:
The system automatically measures and maintains appropriate sheet tension through the tension measuring means and controlled feeding mechanism, eliminating the need for complex manual tension control while ensuring high sticking quality
3Stability of the object's composition
If excessive tension is given to the adhesive sheet, then the adhesive sheet is fed tightly, but warp deformation is caused on the wafer after sticking
Solution Approach 1:
The tension measuring means provides feedback on the actual sheet tension, enabling the control system to adjust feeding parameters to maintain tension within the optimal range that prevents both slack feeding and excessive tension-induced wafer deformation
4Ease of operation
If the sheet is fed with a length longer than needed, then the sticking operation is simple, but the sheet is consumed wastefully
Solution Approach 1:
The appropriate sheet length is determined in advance based on the measured tension and sticking requirements, allowing the system to feed only the necessary amount of sheet for each sticking operation, thereby reducing waste while maintaining operational simplicity
Data Source
AI summary
A sheet sticking apparatus 10 comprises a sheet feed-out unit 12 that feeds out an adhesive sheet S to a position facing a surface of a semiconductor wafer W and a press roller 14 that presses the adhesive sheet S to stick the adhesive sheet S onto the wafer W. The sheet feed-out unit 12 includes a tension measuring means 35 for measuring a tension of the adhesive sheet S between the sheet feed-out unit 12 and the press roller 14 and a sticking angle maintaining means 37 provided with a feed-out head 49 for maintaining a sticking angle θ. After measuring and adjusting the tension immediately before sticking the adhesive sheet S, the feed-out head 49 is lowered in proportion to the movement amount of the press roller 14, thereby the sticking angle θ is maintained, and thus the tension is maintained at a constant level.