Adhesive Sheet Attachment Uniformity on Convex Wafer Periphery
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Solution Overview
Problem
Existing sheet adhesion devices fail to attach adhesive sheets evenly to semiconductor wafers with convex portions at the outer periphery, resulting in gaps between the adhesive sheet and the wafer, especially at the corners of recesses.
Innovation Solution
A sheet adhesion device with a deformation restricting unit that prevents the adhesive sheet from being deformed outward beyond the wafer's periphery, combined with a decompression unit creating pressure differences to bend the sheet and attach it uniformly across the wafer's surface, including recesses and convex portions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a typical sheet adhesion device is used to attach an adhesive sheet to a wafer with a convex portion at the outer periphery, then the adhesive sheet can be attached to the convex portion, but gaps are created between the adhesive sheet and the wafer at the corners of the recess
Solution Approach 1:
A deformation restricting unit is introduced as an intermediary component between the adhesive sheet and the wafer. This unit includes a convex portion that contacts the adhesive sheet and a recess that contacts the ring frame, serving as a mediator to control sheet deformation and prevent gaps at the wafer corners
Solution Approach 2:
The deformation restricting unit applies local quality control by specifically restricting deformation at the outward region of the adhesive sheet (beyond the wafer periphery) while allowing controlled deformation elsewhere. The convex portion of the deformation restricting unit locally contacts the adhesive sheet to prevent excessive outward deformation
2Shape
If the adhesive sheet is allowed to deform freely toward the adherend, then the sheet can conform to the wafer surface, but the outward region of the sheet deforms excessively beyond the wafer periphery
Solution Approach 1:
The deformation restricting unit applies local quality control by specifically restricting deformation at the outward region of the adhesive sheet (beyond the wafer periphery) while allowing controlled deformation elsewhere. The convex portion of the deformation restricting unit locally contacts the adhesive sheet to prevent excessive outward deformation
Solution Approach 2:
The deformation restricting unit serves as an intermediary that mediates between the need for sheet conformity and position accuracy. It allows the sheet to conform to the wafer surface while preventing excessive deformation beyond the wafer periphery through its convex portion
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures the adhesive sheet is attached over a wide range of the wafer's surface with minimal gaps, maintaining close contact even at corners and convex edges, enhancing the adhesion process under reduced pressure.
Implementation Method 1
the sheet deforming unit bends the adhesive sheet toward the adherend by a difference in pressures in the first space and the second space
Implementation Method 2
the decompression unit keeps the adherend and the adhesive sheet positioned to face the adherend under reduced pressure atmosphere
Data Source
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AI summary
A sheet adhesion device (1) includes: a sheet support unit (6,7) that supports an adhesive sheet (MS) positioned to face the adherend (W); a sheet deforming unit (8A,8B) that bends the supported adhesive sheet (MS) toward the adherend (W) to attach the adhesive sheet (MS) on the adherend (W); and a deformation restricting unit (4A) that restricts an adhesive sheet region positioned further outward than the outer periphery of the adherend when the adherend (W) is seen in a planar view from being deformed toward the adherend (W).