Thermosetting Adhesive Sheet for Semiconductor Wafer Warping Control
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Solution Overview
Problem
Thinner semiconductor wafers experience warping issues during the dicing process, leading to increased defect rates and chipping due to stress and microcracks, which conventional thermosetting adhesive sheets fail to adequately address.
Innovation Solution
A thermosetting adhesive sheet with a resin composition containing a (meth)acrylate and a polymerization initiator, featuring a solid (meth)acrylate and trifunctional or higher functional (meth)acrylate, along with a filler, applied to the semiconductor wafer to reduce warping and chipping by contracting and stabilizing the wafer during the dicing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a conventional thermosetting adhesive sheet is applied to reinforce the semiconductor wafer, then chipping is prevented, but warping increases making dicing tape application difficult
Solution Approach 1:
The patent changes the chemical composition parameters of the adhesive layer by specifying precise ratios of (meth)acrylate (55-85 wt%), filler (80-220 parts by mass per 100 parts resin component), and polymerization initiator. This optimized composition enables the adhesive to cure with minimal expansion, reducing wafer warping while maintaining chip resistance
Solution Approach 2:
The patent creates a composite adhesive material combining organic resin component with inorganic filler particles. This composite structure provides both the adhesion strength needed to prevent chipping and the dimensional stability to minimize warping during curing
2Productivity
If thinner semiconductor wafers are used, then manufacturing efficiency improves, but warping increases during dicing
Solution Approach 1:
The patent applies the thermosetting adhesive sheet to the wafer back surface before dicing operations. The adhesive cures in advance to provide mechanical support and flatten the wafer, preventing warping during subsequent dicing processes while enabling use of thinner, more efficient wafers
3Shape
If filler content is increased to reduce warping, then wafer flatness improves, but adhesive strength decreases
Solution Approach 1:
The patent optimizes the filler content to a specific range (80-220 parts by mass per 100 parts resin component) and combines it with optimized resin and initiator ratios. This balanced composition ensures sufficient filler for warping control while maintaining adequate adhesive strength through the optimized organic matrix
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution effectively reduces semiconductor wafer warping and chipping, enabling increased flatness and quality in the dicing process, thereby improving the manufacturing of semiconductor devices.
Implementation Method 1
a thermosetting adhesive layer formed from a resin composition containing a resin component and a filler, the resin component containing a (meth)acrylate and a polymerization initiator
Implementation Method 2
capable of reducing semiconductor wafer warping and chipping by applying the thermosetting sheet to a ground surface of the semiconductor wafer and curing to contract the thermosetting sheet
Data Source
AI summary
Provided are a thermosetting adhesive sheet and a method for manufacturing a semiconductor device capable of reducing semiconductor wafer warping and chipping. The thermosetting adhesive sheet includes a thermosetting adhesive layer containing a resin component and a filler, the resin component containing a (meth)acrylate and a polymerization initiator, the (meth)acrylate containing a solid (meth)acrylate and a trifunctional or higher functional (meth)acrylate, content of the solid (meth)acrylate in the resin component being 55 wt % or more; a total value obtained by multiplying the number of functional groups per unit molecular weight of the (meth)acrylate by content of the (meth)acrylate in the resin component being 2.7E-03 or more, and blending amount of the filler being 80 to 220 pts. mass with respect to 100 pts. mass of the resin component.