Semiconductor Adhesive Sheet Structure for Roll Wrinkle Suppression
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Solution Overview
Problem
Wrinkles occur in adhesive sheets for semiconductor devices when wound in the form of a roll due to height differences between the dicing tape and die attachment film, leading to reduced reliability and potential scattering of foreign substances.
Innovation Solution
An adhesive sheet design featuring a support film with a second dicing tape protruding beyond its adhesive layer, equal in thickness to the dicing tape integrated backside protective film, to compensate for height differences and prevent wrinkles, while using the same materials for the adhesive layers and tapes to maintain economic efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the dicing tape height is increased to cover the DAF, then the DAF is fully covered and protected, but height differences cause wrinkles when wound in a roll
Solution Approach 1:
The support film is selectively positioned only at the edge portion of the separator where height differences occur, rather than uniformly across the entire separator. This local application compensates for the height difference between the dicing tape and DAF at the critical edge regions, preventing wrinkle formation during rolling while maintaining the protective coverage function.
Solution Approach 2:
A support film is introduced as an intermediary element between the dicing tape and the separator edge. This support film acts as a mediator that fills the height gap created by the dicing tape protruding beyond the DAF, providing a smooth transition surface that prevents wrinkles when the separator is wound into a roll.
2Shape
If the support film thickness is increased to compensate for height differences, then wrinkle suppression is improved, but the overall structure becomes more complex and costly
Solution Approach 1:
The support film thickness is precisely controlled to match the height difference between the dicing tape and DAF, rather than using a uniformly thick support film across the entire separator. This parameter optimization ensures adequate wrinkle suppression while minimizing material usage and structural complexity.
3Reliability
If the dicing tape extends beyond the DAF to ensure full coverage, then protection is improved, but foreign substances may scatter and workability deteriorates
Solution Approach 1:
The separator structure is segmented into distinct functional zones: a central region with the DAF and dicing tape for chip bonding and protection, and edge regions with the support film to manage the dicing tape extension. This segmentation allows the dicing tape to extend beyond the DAF for complete coverage while the support film contains the extended portions, preventing foreign substance scattering and maintaining workability.
Data Source
AI summary
An adhesive sheet for a semiconductor device includes a dicing tape integrated backside protective film disposed at predetermined intervals in a longitudinal direction of a separator, and a support film disposed to be spaced apart from the outside of the dicing tape integrated backside protective film to include both long sides of the separator, in which the support film includes an adhesive layer in contact with the separator and a second dicing tape formed on the adhesive layer, and the second dicing tape protrudes toward the dicing tape integrated backside protective film more than the adhesive layer of the support film.